Corner Terminal Resin Structure to Prevent Peeling After Dicing
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Solution Overview
Problem
Conventional leadless package electronic devices face challenges in terminal peeling and bonding strength due to the dicing process, which affects the reliability and mounting strength on circuit boards.
Innovation Solution
The electronic device design includes a conductive member with corner terminals that have exposed surfaces covered by the resin member, enhancing bonding strength and reducing peeling risks through a specific dicing method and plating layer configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the dicing process is used to separate semiconductor chips from the lead frame, then productivity is improved through collective sealing and batch processing, but terminal peeling occurs and bonding strength deteriorates
Solution Approach 1:
The patent applies preliminary action by forming a resin protrusion that extends beyond the lead frame surface before dicing. This protrusion is created in advance during the sealing process, and it serves as a protective structure that prevents terminal peeling during the subsequent dicing operation. The resin protrusion is formed to have a height greater than the lead frame thickness, ensuring it provides sufficient protection during the separating process.
Solution Approach 2:
The patent implements beforehand cushioning by creating a resin protrusion that acts as a cushioning structure prior to dicing. This protrusion absorbs and distributes the mechanical stress generated during the dicing process, preventing direct stress concentration on the terminal-resin bonding interface. The cushioning effect is achieved through the resin material's ability to deform and absorb energy, protecting the terminal connections from peeling forces.
2Ease of operation
If corner terminals are exposed from the sealing resin to enable external connection, then ease of operation is improved for mounting, but terminal peeling risk increases due to reduced support
Solution Approach 1:
The patent applies local quality by creating a resin protrusion specifically at the corner terminal regions where exposure is needed. Rather than uniformly increasing resin coverage, the protrusion is localized to provide enhanced support exactly where terminals are exposed and most vulnerable to peeling. This localized reinforcement maintains mounting convenience while selectively strengthening the anti-peeling capability at critical locations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses terminal peeling and enhances bonding strength with the resin member, allowing for reliable mounting on circuit boards and visual inspection of solder bonding.
Implementation Method 1
a plurality of plating layers are formed on an exposed surface of the conductive member
Data Source
AI summary
An electronic device includes an electronic component, a resin member covering the electronic component, and a conductive member supported by the resin member. The resin member includes a first resin side surface and a second resin side surface that intersect with each other. The conductive member includes a first corner terminal including a first exposed surface exposed from the first resin side surface and a second exposed surface exposed from the second resin side surface. The first corner terminal includes a first surface connected to the first exposed surface and the second exposed surface as viewed in a thickness direction of the resin member. The first surface is covered with the resin member.