Corrosion-Resistant Coating Structure to Prevent Thermal Peeling
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Solution Overview
Problem
Corrosion-resistant coatings in semiconductor manufacturing apparatuses tend to peel off due to thermal history, leading to particle generation and reduced manufacturing yield.
Innovation Solution
A corrosion-resistant member is designed with a metal base material, a corrosion-resistant coating of magnesium fluoride, aluminum fluoride, or aluminum oxide, and a buffer layer containing a trace element, where the buffer layer is formed between the base material and the coating to prevent peeling, with specific thickness and composition ranges to enhance thermal stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a corrosion-resistant coating is formed directly on the base material, then corrosion resistance is improved, but the coating is likely to peel off due to thermal history
Solution Approach 1:
A buffer layer comprising an element of the same kind as the trace element is introduced between the base material and the corrosion-resistant coating. This intermediary layer acts as a mediator that improves interfacial adhesion and reduces peeling during thermal history, while maintaining the corrosion resistance provided by the outer coating layer.
Solution Approach 2:
The corrosion-resistant member is constructed as a composite structure with multiple layers: a base material containing a main element and trace element, a buffer layer comprising the trace element, and a corrosion-resistant coating. This composite structure combines the corrosion resistance of the coating with the adhesion benefits of the buffer layer, solving both requirements simultaneously.
2Stability of the object's composition
If the buffer layer thickness is increased to prevent peeling, then coating adhesion is improved, but the overall structure complexity increases
Solution Approach 1:
The thickness of the buffer layer is optimized to a specific range (5 nm to 100 nm) to achieve the desired adhesion improvement without excessive complexity. This parameter optimization ensures sufficient buffering capacity while maintaining a simple, manufacturable structure that doesn't overly complicate the overall design.
3Reliability
If the corrosion-resistant coating thickness is increased to improve corrosion resistance, then protection capability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The protective function is segmented into two distinct layers: a buffer layer for adhesion and thermal management, and a corrosion-resistant coating for chemical protection. This segmentation allows each layer to be optimized independently, reducing the manufacturing precision burden on any single layer while achieving overall high performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents peeling of the corrosion-resistant coating during thermal exposure, reducing particle generation and maintaining high corrosion resistance, suitable for semiconductor manufacturing equipment like susceptors and shower heads.
Implementation Method 1
the buffer layer contains an element of the same kind as the trace element, and the content ratio obtained by energy dispersive X-ray analysis of the element of the same kind as the trace element contained in the buffer layer is 2% by mass or more and 99% by mass or less
Data Source
AI summary
A corrosion-resistant member including: a metal base material (10); a corrosion-resistant coating (30) formed on the surface of the base material (10); and a buffer layer (20) formed between the base material (10) and the corrosion-resistant coating (30). The base material (10) contains a main element having the highest mass content ratio among elements contained in the base material (10) and a trace element having a mass content ratio of 1% by mass or less. The corrosion-resistant coating (30) contains at least one kind selected from magnesium fluoride, aluminum fluoride, and aluminum oxide. The buffer layer (20) contains an element of the same kind as the trace element, and the content ratio obtained by energy dispersive X-ray analysis of the element of the same kind as the trace element contained in the buffer layer (20) is 2% by mass or more and 99% by mass or less.