Corrosion-Resistant Electrode Structure for Electronic Components
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for manufacturing electronic components, such as surface acoustic wave devices, face challenges with corrosion due to moisture penetration through exposed electrode patterns during the wafer cutting process, leading to characteristic deterioration over time.
Innovation Solution
The implementation of a substrate configuration with a first and second electrode pattern connected by a third electrode pattern made of a corrosion-resistant metal film, which covers the gap between the first and second electrode patterns, effectively preventing moisture-induced corrosion. This configuration includes a third electrode pattern that can be straight, bent, or have a crank shape to ensure greater corrosion prevention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the wafer is divided after characteristic measurement, then mass productivity is improved and measurement is simplified, but electrode patterns are exposed on cut surfaces leading to moisture penetration and corrosion
Solution Approach 1:
The third electrode pattern is formed in advance on the wafer before the cutting process. This preliminary action ensures that when the wafer is subsequently divided into individual components, the corrosion-resistant electrode pattern is already in place to protect the cut surfaces from moisture penetration, thus preventing corrosion while maintaining mass productivity
Solution Approach 2:
The third electrode pattern is specifically positioned at the regions that will become the cut surfaces after wafer division. This local quality approach applies corrosion protection precisely where it is most needed - at the exposed edges of individual components - without requiring additional protective measures on the finished components
2Reliability
If electrode patterns are made of conductive metal, then electrical conductivity is improved, but corrosion resistance deteriorates due to moisture penetration
Solution Approach 1:
The third electrode pattern merges the functions of electrical conduction and corrosion protection. By forming this electrode pattern from a corrosion-resistant conductive metal, the patent combines the electrical functionality of traditional electrode patterns with the protective function of corrosion-resistant coatings, eliminating the need for separate protective layers
Solution Approach 2:
The third electrode pattern is formed from composite or alloy materials that possess both high electrical conductivity and high corrosion resistance. This use of composite materials allows the electrode to simultaneously achieve the electrical performance of conductive metals and the durability of corrosion-resistant materials
Data Source
AI summary
An electronic component has a structure which prevents corrosion caused by moisture intrusion through an electrode pattern extending inwardly from an edge connecting a side and one of main surfaces of a substrate and, therefore, deterioration of a characteristic rarely occurs over time. The electronic component includes, on the first main surface of the substrate, the first electrode pattern extending inwardly from an edge connecting the side of the substrate and the first main surface of the substrate, the second electrode pattern that is opposite to the end of the first electrode pattern through the gap, and the third electrode pattern that is disposed on the first electrode pattern and the second electrode pattern such that it covers the gap. The third electrode pattern is formed from a metal film that is highly resistant to corrosion, the corrosion resistance of which is superior to that of metal films forming the first electrode pattern and the second electrode pattern.