Corrosion-Resistant Contact Pad Structure for Thin Film Acoustic Packaging

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Solution Overview

Problem

Conventional IC packages face challenges in miniaturization and protection against corrosion and harsh chemicals during manufacturing, leading to potential damage and performance issues with electrical components like contact pads.

Innovation Solution

The development of a corrosion-resistant pad integrated into the IC package structure, which includes a piezoelectric layer with a top and bottom electrode, a contact pad, and a capping structure, using materials like aluminum scandium nitride and silicon nitride, providing protection without additional manufacturing steps and maintaining electrical integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If conventional IC packages are miniaturized, then device size is reduced, but protection against corrosion and harmful chemicals deteriorates

Engineering Contradiction:

Improvedevice sizeVSAvoidcorrosion protection

Core Design Contradiction:

Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The patent implements a nested protective layer structure where a corrosion resistant pad layer is positioned between the contact pad and the corrosive environment. This nested arrangement allows the contact pad to be protected while maintaining the miniaturized device geometry, as the protective layer is integrated within the existing package structure rather than adding external bulk.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The corrosion resistant pad serves as an intermediary element between the contact pad and the corrosive manufacturing environment. This intermediate layer prevents direct contact between harmful chemicals and the electrical contacts, thereby protecting the electrical integrity while allowing the device to maintain its small form factor.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If additional protective layers are added to protect against corrosion, then corrosion resistance is improved, but device complexity increases

Engineering Contradiction:

Improvecorrosion resistanceVSAvoidpackage structure

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The corrosion resistant pad is merged with the existing contact pad structure, forming an integrated composite element. Rather than adding a separate protective component, the corrosion resistant material is combined with the contact pad in a single integrated structure, maintaining simplicity while providing protection.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The corrosion resistant pad performs multiple functions simultaneously: it provides electrical connectivity as a contact pad and corrosion protection as a protective barrier. This multi-functionality eliminates the need for separate protective components, thereby reducing overall device complexity while maintaining effective corrosion resistance.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Object-affected harmful factors

If corrosion resistant materials are used, then protection against harmful chemicals is improved, but manufacturing process complexity increases

Engineering Contradiction:

Improvechemical resistanceVSAvoidmanufacturing process

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent selects corrosion resistant materials with specific physical and chemical parameters that enable compatibility with existing manufacturing processes. By carefully choosing materials whose deposition and processing parameters align with standard IC fabrication techniques, the patent achieves corrosion protection without requiring fundamentally new manufacturing equipment or processes.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables miniaturization, improved production yields, higher power capability, and efficient use of IC real estate while protecting against corrosive environments, such as hydrogen chloride, without degrading the electrical contacts or altering frequency characteristics in acoustic filter applications.

Implementation Method 1

a piezoelectric structure disposed on the support layer, wherein the piezoelectric structure comprises: a piezoelectric layer

Methodology Applied

Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS11967938B2Corrosion resistant pad for enhanced thin film acoustic packaging (TFAP)

Publication Date: 2024.04.23 RF360 SINGAPORE PTE LTD

AI summary

An apparatus and method for making an acoustic filter package where the apparatus includes a base layer; a support layer disposed on the base layer; a piezoelectric structure disposed on the support layer; wherein the piezoelectric structure comprises: a piezoelectric layer; a top electrode on a top surface of the piezoelectric layer; a bottom electrode on a bottom surface of the piezoelectric layer; a contact pad coupled to the bottom electrode that extends through an opening in the piezoelectric layer and is coupled to the bottom electrode or the top electrode; and a corrosion resistant pad disposed on the contact pad; and a capping structure disposed on the piezoelectric structure.