Corrosion Sensor Direct Write Deposition Crevice Corrosion
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Solution Overview
Problem
Conventional corrosion sensors are prone to crevice corrosion, which degrades their sensitivity and accuracy over time due to the degradation of the bond between electrodes and dielectric material, leading to inaccurate monitoring of corrosion rates in harsh environments.
Innovation Solution
The method involves applying a non-conductive material to a substrate, writing conductive material at discrete locations, and using direct write deposition techniques to create a seamless interface between conductive and non-conductive portions, reducing crevice corrosion by machining the second layer of non-conductive material to expose conductive material, thereby maintaining sensor accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional corrosion sensors use alternating layers of electrodes and dielectric material, then the sensor can measure general corrosion rates, but the bond between electrodes and dielectric material degrades over time creating gaps that lead to crevice corrosion
Solution Approach 1:
The patent merges the electrode and dielectric material into a single integrated structure where the dielectric material is formed directly on the substrate and the electrode is deposited conformally over it, eliminating the separate bonding interface that causes degradation and crevice corrosion in conventional layered sensors
Solution Approach 2:
The patent extracts and eliminates the problematic bond interface between separate electrode and dielectric material layers by using direct write deposition to create a seamless integrated structure, removing the source of crevice corrosion while preserving the measurement function
2Reliability
If the bond between electrodes and dielectric material degrades, then crevice corrosion occurs exposing larger electrode surface area, but this increases electrical potential and current flow changing sensor calibration
Solution Approach 1:
The patent applies preliminary anti-action by using direct write deposition to create a seamless integrated electrode-dielectric structure from the beginning, preventing the formation of gaps and crevices before they can cause corrosion, rather than allowing degradation to occur and then addressing it
3Ease of manufacture
If conventional sensors are manufactured with separate electrode and dielectric layers, then the manufacturing process is straightforward, but the interface between layers creates low flow regions conducive to crevice corrosion
Solution Approach 1:
The patent replaces the mechanical layering and bonding process with direct write deposition, where the dielectric material is deposited directly onto the substrate and the electrode is deposited conformally over it in a seamless continuous process, eliminating the mechanical interface that causes crevice corrosion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in corrosion sensors that are more resistant to crevice corrosion, maintaining sensitivity and accuracy over time, allowing for reliable detection and measurement of general corrosion rates in harsh environments.
Implementation Method 1
writing a conductive material at discrete locations on the non-conductive material, and writing the conductive material at discrete locations on the previously written conductive material
Implementation Method 2
machining at least a portion of the second layer of non-conductive material to expose at least a portion of the conductive material
Implementation Method 3
The general corrosion is characterized by an oxidation-reduction reaction in which the metal surfaces are oxidized, producing an anode at the oxidation site and a cathode at the reduction site
Data Source
AI summary
A method for manufacturing a corrosion sensor includes applying a first layer of non-conductive material to a substrate, writing a conductive material at discrete locations on the non-conductive material, and writing the conductive material at discrete locations on the previously written conductive material. The method further includes applying a second layer of non-conductive material over the conductive material and machining at least a portion of the second layer of non-conductive material to expose at least a portion of the conductive material.


