Corrugated Cooler Flow Channel for Semiconductor Cooling

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Solution Overview

Problem

Conventional coolers for semiconductor elements face challenges in achieving both high cooling efficiency and low pressure loss, as the fin structure often compromises between radiation performance and coolant flow efficiency.

Innovation Solution

A cooler with a corrugated flow channel design between top and bottom plates, where the channel faces bend synchronously towards the plates, enhancing fluid contact area and reducing pressure loss through swirling flow suppression.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional straight fins are used, then the structure is simple and manufacturing is easy, but the coolant contact time is short and radiation performance is insufficient

Engineering Contradiction:
Improvecooling efficiencyVSAvoidfin structure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The fin structure is transformed from straight to corrugated with curved surfaces. The corrugated fins have wave-shaped profiles that increase the surface area and extend the coolant contact path, improving heat radiation performance while maintaining manageable structural complexity

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The fin design adds dimensional complexity by introducing corrugations in multiple directions. The fins have corrugations both in the plane of the fin and perpendicular to it, creating a three-dimensional wave structure that maximizes surface area within the available space

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If corrugated fins with increased contact area are used, then cooling efficiency improves, but pressure loss of coolant increases due to flow turbulence

Engineering Contradiction:
Improvecooling efficiencyVSAvoidpressure loss
Core Design Contradiction:
TemperatureVSLoss of energy

Solution Approach 1:

Different regions of the fin structure have different corrugation characteristics. The fins have varying amplitude and wavelength of corrugations at different locations, allowing optimization of heat transfer in high-temperature zones while minimizing flow resistance in other areas

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The corrugation parameters (amplitude, wavelength, orientation) are optimized to achieve the right balance between surface area and flow resistance. By carefully selecting these parameters, the design maximizes cooling efficiency while keeping pressure loss within acceptable limits

Inventive Principle:
Principle #35Parameter changes

3Area of stationary object

If the flow channel has a corrugated shape with synchronized bending, then the fluid contact area with inner walls increases, but the manufacturing precision requirements increase

Engineering Contradiction:
Improvefluid contact areaVSAvoidflow channel shape precision
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The flow channel is divided into multiple fin segments that can be manufactured separately and then assembled. Each fin can be produced with standard corrugation patterns, and the overall complex shape is achieved through the arrangement of these standardized segments rather than requiring a single precision-machined component

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The corrugated design improves cooling efficiency while minimizing pressure loss, effectively cooling semiconductor elements with increased contact area and reduced fluid turbulence.

Implementation Method 1

fluid flows through the flow channel between the top plate and the bottom plate... fluid to travel while swaying toward the top plate and the bottom plate... enables a large contact area of fluid with the inner walls of the flow channel

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

allows the fluid to flow while suppressing pressure loss due to swirling flow

Methodology Applied
Scientific EffectFluid flow:

Implementation Method 3

cooler being configured to cool a semiconductor element with fluid flowing through the flow channel

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11075144B2Cooler and semiconductor module
Publication Date: 2021.07.27 FUJI ELECTRIC CO LTD
  • US11075144B2 patent drawing
  • US11075144B2 patent drawing
  • US11075144B2 patent drawing

AI summary

Provided is a cooler having high cooling efficiency and low pressure loss of fluid. A cooler includes: a flow-channel part at least including a plate-like fin (top plate) and a plate-like fin (bottom plate); and a continuous groove-like flow channel defined between the top plate and the bottom plate to flow fluid, the cooler being configured to cool semiconductor elements. When the flow-channel part is viewed from the direction parallel to the top plate and intersecting the flow channel, the flow channel has a corrugated shape so that a face of the flow channel closer to the top plate and a face of the flow channel closer to the bottom plate bend in a synchronized manner toward the top plate and the bottom plate.