Corrugated Cooling Plate for Solid State Memory Heat Extraction
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Solution Overview
Problem
Densely packed solid state memory units in data storage systems face challenges in effectively removing heat due to limited clearance between units, making conventional convection-based cooling inadequate for maintaining optimal operating conditions.
Innovation Solution
A thermally conductive corrugated plate with varying corrugations and channels is positioned adjacent to the memory units to facilitate the flow of a cooling fluid, enhancing heat extraction through both conduction and convection, and optionally coated with thermal interface material for improved heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If solid state memory units are densely packed to increase storage capacity, then storage density is improved, but heat removal capability deteriorates due to limited clearance between units
Solution Approach 1:
The cooling apparatus transitions from conventional convection-based cooling (three-dimensional space utilization) to conduction-based cooling through corrugated plates positioned between memory units (two-dimensional interface). The corrugations create extended thermal contact surfaces that conduct heat laterally across the plate structure, effectively utilizing the limited clearance space between densely packed units without requiring additional vertical or lateral volume.
Solution Approach 2:
The corrugated cooling plate serves as a thermal intermediary component positioned between adjacent solid state memory units. It conducts heat away from multiple memory units simultaneously through its corrugated structure, which provides extended thermal contact surfaces. The plate material and structure are specifically designed to facilitate heat conduction from the memory units to the cooling fluid flowing through or over the plate.
2Device complexity
If conventional convection-based cooling is used, then device simplicity is maintained, but cooling effectiveness deteriorates in densely packed configurations with limited clearance
Solution Approach 1:
The invention extracts the cooling function from the memory unit assembly itself and implements it through separate corrugated cooling plates positioned between units. This allows the cooling mechanism to be independently optimized for conduction-based heat removal in confined spaces, while the memory units maintain their original simple convection-cooled design. The cooling plates are inserted into the limited clearance spaces without requiring redesign of the memory units.
3Temperature
If corrugated cooling plates are inserted between memory units, then heat extraction capability is improved, but device complexity increases
Solution Approach 1:
The cooling system is segmented into multiple individual corrugated plates, each positioned between specific pairs of memory units. Each plate handles the thermal management for its local region independently. This segmentation allows for modular installation and maintenance, and the corrugated structure itself is segmented into multiple channels or ridges that distribute cooling across different thermal zones within each plate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively extracts heat from densely packed solid state memory units, maintaining optimal operating conditions by leveraging both conduction and convection cooling methods, even in constrained spaces.
Implementation Method 1
A thermally conductive corrugated plate having a plurality of corrugations contactingly engages the outer planar surface of the solid state memory integrated circuit device
Implementation Method 2
A cooling fan generates a flow of cooling fluid that passes through the plurality of parallel channels to remove heat from the first and second solid state memory units
Data Source
AI summary
Apparatus for thermally cooling a solid state memory unit, such as but not limited to densely packed flash memory storage devices in a data storage system. In some embodiments, a thermally conductive corrugated plate has one or more corrugations. The corrugations are adapted for positioning adjacent at least one solid state memory unit to form one or more channels for a cooling fluid to flow therethrough.