Cooling Plates Linked by Corrugated Tubes for Chip Height Adaptation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing heat dissipation systems face challenges in accommodating height differences between chips due to rigid metal tubes requiring precise parameters and high flatness control, leading to limited design flexibility, increased cost, and reduced pressure resistance.
Innovation Solution
A heat dissipation apparatus using extendable corrugated tubes to connect cooling plates, allowing for flexible adaptation to height differences and enhanced turbulence for improved heat exchange, with metal tubes providing stability and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If rigid metal tubes are used to connect cooling plates, then pressure resistance and reliability are improved, but adaptability to height differences and design flexibility deteriorate
Solution Approach 1:
The patent replaces rigid metal tubes with flexible corrugated tubes to connect cooling plates. The corrugated structure provides both flexibility to adapt to height differences between chips and sufficient pressure resistance to maintain liquid cooling effectiveness, resolving the contradiction between rigidity and adaptability.
Solution Approach 2:
The corrugated tube design allows the connection structure to dynamically adapt to varying chip heights through its expandable and contractable corrugated sections, while maintaining structural integrity and pressure resistance during operation.
2Reliability
If rigid metal tubes with precise parameters are used, then pressure resistance is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The corrugated tube structure inherently provides pressure resistance through its geometric design rather than relying on precise wall thickness control, simplifying manufacturing while maintaining reliability.
3Adaptability or versatility
If one-plate heat sink with interface material is used, then adaptability to height differences is improved, but space occupation and cost increase
Solution Approach 1:
The flexible corrugated tubes provide the necessary adaptability to height differences without requiring additional interface materials or increasing overall device volume, as the tube itself absorbs the height variation.
4Temperature
If one-plate heat sink is used, then heat dissipation is achieved, but flatness control requirements and cost increase
Solution Approach 1:
The patent uses separate cooling plates for each chip connected by flexible corrugated tubes, allowing each cooling plate to independently contact its corresponding chip without requiring high flatness control across a large single plate, thereby reducing manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient heat dissipation by maintaining close contact between chips and cooling plates, enhancing flexibility and pressure resistance while increasing turbulence for better heat exchange performance.
Implementation Method 1
The corrugated tube structure can increase the turbulence degree of the working medium in the tube
Implementation Method 2
The cooling plates are attached to the chips and configured to dissipate heat of the chips
Data Source
AI summary
Disclosed are a heat dissipation apparatus and an electronic device. The heat dissipation apparatus may include: a cooling component, comprising at least two cooling plates in which a flow channel for containing a working medium is arranged; and a first tube, through which the cooling plates are connected, allowing the flow channels of the cooling plates to be communicated with each other, at least part of the first tube being an extendable corrugated tube.