Corrugated Thermal Coupling in SFP Cages for Lower Thermal Resistance

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Solution Overview

Problem

Conventional thermal management systems for high-power optical transceivers in dense units face challenges with heat build-up and increased thermal resistance, requiring multiple components that increase manufacturing complexity and power consumption.

Innovation Solution

An interface module with a corrugated thermal coupling member integrated into the cage design, eliminating the need for a separate SFP heat sink and thermal pad, providing a direct thermal pathway between the connector and the main unit heat sink.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional thermal management systems use separate heat sinks and thermal pads, then thermal management is provided, but device complexity and manufacturing complexity increase

Engineering Contradiction:

Improvethermal managementVSAvoidmanufacturing complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the thermal coupling function with the cage structure by integrating a corrugated thermal coupling member directly into the cage body. This eliminates the need for separate heat sinks and thermal pads, reducing device complexity while maintaining effective thermal management. The corrugated member provides both structural support and thermal conduction pathways within a single integrated component.

Inventive Principle:

Principle #5Merging (Combining)

2Temperature

If more thermal management components are added, then thermal resistance is reduced, but device complexity increases

Engineering Contradiction:

Improvethermal resistanceVSAvoidnumber of components

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The thermal coupling member is designed with a corrugated structure featuring multiple ridges and valleys that create segmented thermal conduction pathways. These multiple pathways work in parallel to reduce thermal resistance between the connector and heat sink, while the entire structure remains a single integrated component rather than multiple separate parts.

Inventive Principle:

Principle #1Segmentation

3Use of energy by moving object

If higher power consumption components are used, then functionality increases, but heat build-up increases

Engineering Contradiction:

Improvepower consumptionVSAvoidheat build-up

Core Design Contradiction:

Use of energy by moving objectVSTemperature

Solution Approach 1:

The corrugated thermal coupling member modifies the thermal conduction parameters by creating multiple parallel heat flow pathways through its ridges and valleys. This increases the effective thermal conductivity and heat dissipation capacity, enabling the system to handle higher power consumption components without excessive heat build-up.

Inventive Principle:

Principle #35Parameter changes

4Length of stationary object

If unit thickness is reduced, then space efficiency increases, but thermal management capability decreases

Engineering Contradiction:

Improveunit thicknessVSAvoidthermal management capability

Core Design Contradiction:

Length of stationary objectVSTemperature

Solution Approach 1:

The corrugated thermal coupling member utilizes the third dimension (depth/thickness) efficiently by creating a wavy profile with ridges and valleys. This allows the thermal pathways to extend through the available thickness while maintaining a compact overall form factor, enabling effective thermal management without increasing unit thickness.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves thermal performance by reducing thermal resistance, allowing for higher power consumption components without increasing unit thickness, enabling the use of less powerful and quieter fan trays, and reducing manufacturing complexity and cost.

Implementation Method 1

providing a direct thermal pathway between the connector and the main unit heat sink

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The corrugated thermal coupling member may be configured be deformed by contact with the main unit heat sink when the main unit heat sink is affixed to the interface module

Methodology Applied

Scientific EffectElastic deformation: Deformation

Data Source

PatentUS20260052653A1Interface module with corrugated thermal coupling member

Publication Date: 2026.02.19 TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)

AI summary

An interface module according to some embodiments includes a cage, such as a small form factor pluggable (SFP) cage, configured to guide a signal connector towards an interface for connection with the signal connector. The cage includes a first side, an opening in the first side of the cage, and a corrugated thermal coupling member attached to the cage and extending across the opening in the first side of the cage. The corrugated thermal coupling member includes a plurality of alternating ridges and valleys that alternatingly extend above and below the first side.