Corrugated SOFC Stack Architecture for Thermal Stress Compliance

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Solution Overview

Problem

Existing solid oxide fuel cell (SOFC) and solid oxide electrolysis cell (SOEC) stacks face challenges in achieving marketable price, reasonable performance, and useful lifetime, particularly in terms of power density, volume, weight, and thermal management.

Innovation Solution

The development of high power density compact SOFC stacks with corrugated interconnects that form fuel and oxidant channels, sealed via sealing members to provide compliance and reduce thermal stress, while also optimizing the integration of components for smaller cell sizes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional rigid interconnects are used in SOFC stacks, then structural strength is maintained, but thermal stress accumulates and compliance is reduced

Engineering Contradiction:
Improvestructural strengthVSAvoidcompliance
Core Design Contradiction:
StrengthVSAdaptability or versatility

Solution Approach 1:

The interconnects incorporate corrugated structures with curved wave patterns instead of flat rigid surfaces. These corrugations allow the interconnects to flex and expand/contract in response to thermal cycling while maintaining structural integrity, thus providing compliance without sacrificing strength.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The interconnect geometry is modified by introducing corrugations that change the mechanical parameters of the structure. The wave-like profile alters the stiffness and flexibility characteristics, enabling the interconnect to accommodate thermal expansion and contraction while maintaining adequate structural strength.

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If larger cell sizes are used in SOFC stacks, then manufacturing and sealing are easier, but power density per unit volume decreases

Engineering Contradiction:
Improvesealing easeVSAvoidpower density
Core Design Contradiction:
Ease of manufactureVSPower

Solution Approach 1:

The stack is divided into multiple smaller cell units arranged in series, with each cell separated by individual interconnects. This segmentation allows for easier sealing at each interface while achieving high overall power density through the cumulative effect of multiple compact cells.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The design transitions from large planar cells to a three-dimensional stacked configuration with multiple smaller cells arranged vertically. This dimensional approach increases power density by utilizing vertical space efficiently while maintaining manageable cell sizes for manufacturing and sealing.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If more material is used in interconnects, then structural strength and durability improve, but weight and volume increase

Engineering Contradiction:
ImprovedurabilityVSAvoidstack weight
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

The interconnects are designed as thin-walled corrugated structures that provide adequate mechanical strength and durability through their geometric configuration rather than material thickness. The corrugated profile acts as a structural reinforcement, allowing thin materials to achieve the required durability without excessive weight.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The interconnects utilize composite construction combining thin metal substrates with protective coatings or ceramic layers. This composite approach provides enhanced durability and thermal resistance while minimizing weight, as the thin base material provides structural integrity and the coatings provide protective functions.

Inventive Principle:
Principle #40Composite materials

4Ease of manufacture

If uniform interconnect design is used, then manufacturing is simpler, but thermal stress distribution becomes non-uniform

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidthermal stress distribution
Core Design Contradiction:
Ease of manufactureVSStress or pressure

Solution Approach 1:

The corrugated interconnects feature asymmetric wave patterns with varying amplitudes and wavelengths along their length. This asymmetric geometry creates non-uniform flexibility zones that distribute thermal stress more evenly across the stack, with stiffer regions accommodating expansion and more flexible regions absorbing stress concentrations.

Inventive Principle:
Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in stacks with significantly reduced material content, achieving higher power density per unit weight and volume, improved thermal control, and potential cost reductions, while maintaining or improving performance and longevity.

Implementation Method 1

the interconnects configured to provide compliance to the electrochemical cell stack

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

fluidly isolated via sealing members

Methodology Applied
Scientific EffectSealing:

Implementation Method 3

Oxygen reacts with electrons at the cathode to form oxygen ions, which are conducted through the ion-conducting ceramic electrolyte to the anode. At the anode, oxygen ions combine with available fuel to form products thereby liberating electrons to produce electrical power

Methodology Applied
Scientific EffectElectrochemical reaction:

Implementation Method 4

the corrugations forming a plurality of fuel channels on one side and a plurality of oxidant channels on the opposite side

Methodology Applied
Scientific EffectFluid flow:

Data Source

PatentUS12327888B2Compact high temperature electrochemical cell stack architecture
Publication Date: 2025.06.10 VERSA POWER SYST LTD
  • US12327888B2 patent drawing
  • US12327888B2 patent drawing
  • US12327888B2 patent drawing

AI summary

A top compression plate assembly for an electrochemical cell stack includes a top end plate configured to interface with a top end of a stack of electrochemical cells, a top compression plate positioned on the top end plate, and a plurality of springs coupled to a periphery of the top compression plate. The springs are configured to cause the top compression plate to exert a compressive force on the top end plate.