Hermetic Cortical Prosthesis Fixation for Heat Dissipation

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Solution Overview

Problem

Current implantable devices for stimulating the visual cortex face challenges in miniaturization, heat dissipation, and long-term reliability, particularly in maintaining a hermetic seal and minimizing irritation or erosion through the scalp, which can lead to infection.

Innovation Solution

An implantable device with a hermetic electronics package attached to a flexible circuit electrode array, featuring a trapezoidal electrode configuration, a fixation structure for securing and dissipating heat, and a secondary inductive coil for wireless communication, utilizing platinum-coated electrodes for chronic charge delivery and impedance monitoring, ensuring safety and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the electronics package is miniaturized for implantation within the head, then the device size is reduced, but heat dissipation becomes more difficult

Engineering Contradiction:
Improvedevice sizeVSAvoidheat dissipation
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

A fixation structure acts as an intermediary thermal conduit between the electronics package and the skull. The structure includes a fixation member extending from the electronics package to contact the skull, creating a thermal pathway that dissipates heat from the miniaturized device to the skull without requiring the device itself to be large

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces active cooling mechanical systems with passive thermal conduction through the fixation structure. The thermal management is achieved through the natural heat conduction properties of the fixation materials and their geometric configuration rather than mechanical cooling components

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Stability of the object's composition

If the electronics package is secured to the skull with a fixation structure, then long-term stability is improved, but irritation or erosion through the scalp may occur leading to infection

Engineering Contradiction:
Improvelong-term stabilityVSAvoidscalp irritation and erosion
Core Design Contradiction:
Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The fixation structure incorporates a flexible membrane that spans between the skull and scalp. This membrane distributes the mechanical stress of the fixation across a larger area, preventing concentration of force that would cause erosion or irritation to the scalp while maintaining stable attachment

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The fixation structure is designed with differentiated local properties: rigid components for stable skull attachment and flexible membrane portions for gentle scalp contact. This local variation in mechanical properties allows the same structure to provide both stability and protection against tissue damage

Inventive Principle:
Principle #3Local quality

3Reliability

If a hermetic seal is maintained for long-term reliability, then device reliability is improved, but heat dissipation capability is reduced

Engineering Contradiction:
Improvehermetic seal reliabilityVSAvoidheat dissipation capability
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The thermal management system is segmented into two functional zones: a hermetic sealed zone containing the electronics package for reliability, and a non-hermetic fixation structure extending to the skull for heat dissipation. This segmentation allows each zone to optimize its primary function without compromising the other

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The device effectively stimulates the visual cortex with high current output and programmable waveforms, providing robust and reliable neural recording and stimulation, while minimizing irritation and ensuring long-term safety and reliability, with successful animal studies demonstrating biocompatibility and functionality.

Implementation Method 1

a hermetic electronics package that houses electronics... a fixation structure that secures, protects and dissipates heat from the electronics package

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

a secondary inductive coil for wireless communication

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentEP3294409B1Cortical visual prosthesis
Publication Date: 2023.11.22 CORTIGENT INC
  • EP3294409B1 patent drawingFigure 1
  • EP3294409B1 patent drawingFigure 2A~2B
  • EP3294409B1 patent drawingFigure 3~4

AI summary

The present invention consists of an implantable device with a hermetic electronics package that houses electronics. The hermetic package is attached to a flexible circuit electrode array having its electrodes arranged in a trapezoidal electrode array field that is suitable to stimulate the visual cortex. The hermetic electronics package is provided with a fixation structure that secures, protects and dissipates heat from the electronics package. The entire implantable device can be entirely implanted within the head.