Counter-Current RF Antenna Array for Compact High-Density Plasma
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Solution Overview
Problem
Current inductively coupled plasma systems are inefficient in generating high density plasma in a small volume process space, which is necessary for atomic layer deposition (ALD) and atomic layer etch (ALE) processes due to large process spaces that increase cycle time and reduce throughput.
Innovation Solution
An RF antenna with an array of parallel conductive lines oriented along a plane, where current flow in adjacent lines occurs in opposite directions to form a counter current inductive array, generating localized magnetic fields and enabling high density plasma generation in a small process space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a large process space is used to accommodate the reach of the global magnetic field and minimize non-uniformity effects, then plasma distribution uniformity is improved, but cycle time increases and throughput decreases
Solution Approach 1:
The patent segments the plasma generation system into multiple independent RF antenna modules, each generating localized plasma regions. This allows the process space to be divided into smaller zones that can be independently controlled, reducing the overall cycle time while maintaining uniform plasma distribution through coordinated operation of multiple segments.
Solution Approach 2:
The patent transitions from a single large-scale plasma generation approach to a multi-dimensional array of smaller plasma sources. By distributing multiple RF antenna modules across the substrate surface in a spatial array, the system achieves uniform plasma coverage through dimensional distribution rather than relying on a single large process space.
2Productivity
If a small process space is used to reduce cycle time and improve throughput, then productivity is improved, but plasma density uniformity deteriorates
Solution Approach 1:
The patent divides the plasma generation function into multiple independent RF antenna modules that operate in parallel within a compact process space. Each module generates localized plasma with controlled density, and the collective arrangement ensures uniform plasma distribution across the substrate while maintaining a small overall process volume for rapid cycling.
Solution Approach 2:
The patent implements local quality control by allowing each RF antenna module to independently generate plasma with specific density characteristics tailored to its local position. This enables uniform plasma distribution across the substrate by optimizing local plasma properties rather than relying on a single global plasma region.
3Power
If traditional ICP or TCP systems are used, then plasma generation capability is achieved, but device volume increases and compactness is lost
Solution Approach 1:
The patent adopts a planar array configuration for the RF antenna modules, distributing plasma generation capability across a two-dimensional surface rather than using a large vertical or three-dimensional structure. This dimensional reorganization maintains strong plasma generation capability while significantly reducing the overall device volume and achieving a compact form factor.
Solution Approach 2:
The patent combines multiple RF antenna modules into a single integrated array structure that functions as a unified plasma generation system. By merging the plasma generation capability of multiple compact modules into one coordinated system, the patent achieves traditional ICP/TCP plasma generation performance within a reduced device volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for high density plasma generation with uniform distribution in a small volume, reducing cycle time and improving throughput for ALD and ALE processes by localizing magnetic fields and plasma generation.
Implementation Method 1
An RF antenna is configured, when powered, to inductively generate plasma in a process region of a chamber
Implementation Method 2
current flow in the adjacent first and second conductive lines occurs in an opposite direction... generating localized magnetic fields
Data Source
AI summary
An RF antenna is configured, when powered, to inductively generate plasma in a process region of a chamber, including: an array of parallel conductive lines that are oriented along a plane, the array including a first conductive line, a second conductive line, a third conductive line, and a fourth conductive line; wherein the first and second conductive lines are adjacent, wherein the second and third conductive lines are adjacent, and wherein the third and fourth conductive lines are adjacent; wherein when the RF antenna is powered, current flow in the adjacent first and second conductive lines occurs in an opposite direction, current flow in the adjacent second and third conductive lines occurs in a same direction, current flow in the adjacent third and fourth conductive lines occurs in an opposite direction.