Counterflow Expanding Microchannel Cooling Architecture
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Solution Overview
Problem
Conventional cold plates and cooling systems face inefficiencies in heat transfer due to limited coolant flow distribution and temperature gradients, leading to thermal stress and potential premature failures in electronic components.
Innovation Solution
A cold plate design featuring multiple layers with counterflow cooling channels that expand in width as they traverse the heat transfer area, allowing coolant to flow in counter directions on parallel planes, stabilizing two-phase flow and reducing temperature gradients through uniform heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cold plates use single-phase coolant flow, then the structure is simple, but heat transfer efficiency is limited and temperature gradients cause thermal stress
Solution Approach 1:
The cooling system is divided into multiple independent cooling channels (first cooling channel, second cooling channel) that operate in parallel. Each channel handles a specific flow direction, segmenting the heat transfer function to eliminate temperature gradients and thermal stress while maintaining structural manageability
Solution Approach 2:
The patent transitions from single-phase flow to two-phase counterflow, adding a dimensional aspect to the cooling mechanism. The counterflow arrangement in opposite directions creates a more sophisticated heat transfer dimension that eliminates thermal stress without excessive structural complexity
2Productivity
If cooling channels have constant width, then manufacturing is easy, but coolant flow distribution is uneven leading to reduced cooling efficiency
Solution Approach 1:
The cooling channels feature variable cross-sectional areas along their length, with different widths at different positions. This local variation in geometry optimizes coolant flow distribution and heat transfer efficiency at each location, achieving superior cooling performance while the overall structure remains manufacturable through standard fabrication techniques
3Reliability
If coolant flows in single direction, then the system is simple, but temperature gradients develop causing thermal stress in electronic components
Solution Approach 1:
The patent implements counterflow by having the first coolant flow in one direction through the first cooling channel while the second coolant flows in the opposite direction through the second cooling channel. This inverted flow arrangement eliminates temperature gradients and thermal stress, improving component reliability while the dual-channel configuration remains practically manageable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The counterflow design enhances cooling efficiency by maintaining a uniform void fraction and heat transfer coefficient, reducing thermal stress and extending the distance coolant can traverse before vaporizing, thus improving the reliability of electronic components.
Implementation Method 1
stabilizing two-phase flow and reducing temperature gradients through uniform heat transfer
Implementation Method 2
counterflow cooling channels that expand in width as they traverse the heat transfer area, allowing coolant to flow in counter directions on parallel planes
Data Source
AI summary
Devices that have integrated cooling structures for counterflow, two-phase cooling and systems thereof are provided. In one example, a first structure can comprise a first cooling channel. The first cooling channel can have a first value of width that increases as the first cooling channel extends from a first side of a heat transfer area towards a second side of the heat transfer area. Also, a second structure can comprise a second cooing channel. The second cooling channel can have a second value of width that increases as the second cooling channel extends from the second side of the heat transfer area towards the first side of the heat transfer area.