Coupled Antenna Structure With Thickness-Tuned Bandwidth Expansion
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Solution Overview
Problem
Existing antenna structures made from High Density Interconnect (HDI) printed circuit boards have complex manufacturing processes, high production costs, and limited bandwidth due to their multilayer structure.
Innovation Solution
An antenna structure using a single-layer carrier with a switching circuit, a first radiating element, and a second radiating element, where the carrier has different thickness parts with a circuit layer and ground layer, and the elements are connected through conductive through holes, allowing for increased bandwidth and simplified production using laser direct structuring technology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If HDI PCB multilayer structure is used for antenna, then manufacturing precision and structural stability are improved, but device complexity and production cost increase
Solution Approach 1:
The antenna structure is divided into two independent radiating elements (first and second radiating elements) that are spatially separated and coupled together. This segmentation allows each element to be optimized independently while achieving the desired overall performance, simplifying the manufacturing process compared to traditional multilayer HDI PCB antennas.
Solution Approach 2:
The patent transitions from a planar multilayer structure to a three-dimensional configuration by placing radiating elements at different heights (first carrying part with greater thickness, second carrying part with lesser thickness). This dimensional change enables improved radiation performance without requiring complex multilayer PCB structures.
2Stability of the object's composition
If HDI PCB multilayer structure is used for antenna, then structural stability is improved, but production time and cost increase
Solution Approach 1:
The patent combines the radiating elements, feeding mechanism, and ground structure into a single integrated antenna assembly. This merging eliminates the need for separate multilayer PCB lamination processes, reducing production time and cost while maintaining structural stability through the unified design.
Solution Approach 2:
The patent utilizes different thickness parameters of the carrying parts (first carrying part with greater thickness, second carrying part with lesser thickness) to achieve both structural stability and improved radiation performance. By optimizing these dimensional parameters, the antenna achieves stable composition without requiring complex multilayer structures.
3Ease of manufacture
If traditional antenna structure is used, then manufacturing process is simple, but bandwidth is insufficient
Solution Approach 1:
The patent introduces a switching circuit that dynamically switches between different radiating elements (first and second radiating elements) to adapt to different frequency bands. This dynamic switching capability enables the antenna to cover multiple frequency ranges including 5G bands, significantly improving bandwidth while maintaining manufacturing simplicity.
Solution Approach 2:
The antenna structure is designed with multi-functionality by incorporating both first and second radiating elements that can operate in different frequency modes. The switching circuit enables the same physical structure to serve multiple communication standards and frequency bands, achieving universal adaptability without complicating the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces production costs, simplifies the manufacturing process, and increases bandwidth by controlling the thickness of the carrier parts to reduce capacitance and adjust operating frequencies, achieving a low-frequency range of 500 MHz and improved frequency offset amplitude.
Implementation Method 1
the second radiating element and the first radiating element are apart from each other and couple with each other
Implementation Method 2
The thickness of the first carrying part is greater than the thickness of the second carrying part... by controlling the thickness of the carrier parts to reduce capacitance and adjust operating frequencies
Data Source
AI summary
An antenna structure and an electronic device are provided. The electronic device includes a housing and an antenna structure disposed in the housing. The antenna structure includes a carrier having a first carrying part and a second carrying part connected to each other, a switching circuit, a first radiating element, and a second radiating element. A thickness of the first carrying part is greater than a thickness of the second carrying part. The second carrying part includes a circuit layer and a ground layer respectively formed on opposite surfaces of the second carrying part. The switching circuit is located on the circuit layer. The first radiating element and the second radiating element are disposed on the carrier and respectively electrically connected to a feed element and the switching circuit. The second radiating element and the first radiating element are apart from and couple with each other.