Coupled Semiconductor Thermal Fill for Uniform Heat Conduction
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Solution Overview
Problem
Coupled semiconductor systems often experience uneven thermal conductivity due to mismatches in thermal conductivity between different regions, leading to hot spots and non-uniform operating characteristics.
Innovation Solution
Implementing a semiconductor material with a thermal conductivity similar to that of the coupled components in unoccupied regions, directly coupled with the components using fusion bonding or hybrid bonding, to create a more uniform thermal path and reduce hot spots.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different semiconductor components with different thermal conductivities are coupled together, then device functionality is achieved, but thermal conductivity uniformity deteriorates causing hot spots
Solution Approach 1:
The patent applies homogeneity by introducing a semiconductor material in unoccupied regions that has thermal conductivity similar to the coupled semiconductor components. This creates a more uniform thermal conductivity distribution across the entire system, preventing hot spots while maintaining the functionality of different components with different thermal properties.
Solution Approach 2:
The patent applies local quality by selectively placing semiconductor material in specific unoccupied regions where thermal conductivity mismatch causes problems. Rather than changing the entire system, the solution targets specific locations with thermal interface materials or semiconductor material to locally adjust thermal conductivity and achieve overall uniformity.
2Temperature
If semiconductor material is added to unoccupied regions to improve thermal uniformity, then thermal conductivity uniformity is enhanced, but device complexity increases
Solution Approach 1:
The patent uses homogeneity to simplify the thermal profile by making thermal conductivity more uniform across the system. While this adds material, it eliminates the need for complex thermal management systems such as active cooling or sophisticated heat sinking arrangements, thereby reducing overall system complexity in terms of thermal control.
Solution Approach 2:
The semiconductor material or thermal interface material acts as an intermediary between components with different thermal conductivities. This intermediary layer mediates the thermal transfer, creating a gradual thermal transition rather than abrupt interfaces, which simplifies the thermal behavior of the overall system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances thermal conductivity uniformity across the semiconductor system, reducing hot spots and supporting more uniform operating characteristics in different regions.
Implementation Method 1
an arrangement of materials of a semiconductor system may be associated with a mismatch of thermal conductivities
Implementation Method 2
coupling the surface of the first semiconductor component with the first portion of the surface of the second semiconductor component forming a communicative coupling
Data Source
AI summary
Methods, systems, and devices for thermal distribution techniques in coupled semiconductor systems are described. A semiconductor system may be formed by coupling various semiconductor components with one another, and may also implement a semiconductor material to support a thermal path having a thermal conductivity that is relatively close to a thermal conductivity through the coupled semiconductor components of the semiconductor system. Such a semiconductor material may be located in regions of the semiconductor system that are otherwise unoccupied by functional (e.g., electrically operable) semiconductor components and may, in some examples, be electrically inoperable (e.g., may lack functional circuitry). For implementations in which functional semiconductor components are directly coupled (e.g., by fusion bonding or hybrid bonding techniques), the semiconductor material may also be directly coupled with at least one of the semiconductor components.