Coupled Feed Microstrip Antenna Without Through Hole
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Solution Overview
Problem
The manufacturing process of microstrip antennas is complicated and costly due to the need for a through hole in the insulating substrate, which increases material consumption and processing steps.
Innovation Solution
A microstrip antenna design that uses electromagnetic coupling to connect the feed-in unit with the first conducting layer without a through hole, allowing for adjustable electromagnetic coupling and resonant frequencies by varying the isolation zone and conducting layer dimensions, and incorporating insulating units to lower resonant frequencies without altering size or material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a through hole is made through the insulating substrate to connect the conducting element, then the microstrip antenna can transmit and receive wireless signals, but the manufacturing process becomes complicated and material consumption increases
Solution Approach 1:
The patent removes the through hole structure from the microstrip antenna design. Instead of penetrating the insulating substrate with a conducting element, the invention uses electromagnetic coupling between conductors on the same side of the substrate, thereby extracting the problematic through hole component while maintaining signal transmission functionality
Solution Approach 2:
The patent replaces the mechanical connection method (physical through hole with conducting element) with an electromagnetic field-based connection method. The feed-in unit establishes electrical connection to the first conducting layer through electromagnetic coupling without physical penetration, substituting mechanical structure with electromagnetic interaction
2Ease of manufacture
If a through hole is made through the insulating substrate, then the conducting element can be connected to the first conducting layer, but processing steps increase and manufacturing cost rises
Solution Approach 1:
The patent extracts and eliminates the through hole fabrication step from the manufacturing process. By using electromagnetic coupling between planar conductors, the complex steps of drilling, plating, and inserting conducting elements are removed, simplifying the overall manufacturing process
Solution Approach 2:
The patent uses a planar copy approach where the feed-in unit and first conducting layer are both formed as planar patterns on the substrate surface. This copying method on the same plane avoids the need for three-dimensional through-hole construction, reducing manufacturing complexity and time
3Reliability
If the height of the insulating substrate is increased, then the electromagnetic coupling amount increases, but the overall antenna size increases
Solution Approach 1:
The patent adjusts electromagnetic coupling strength by changing parameters such as the area of the feed-in unit, the position and dimensions of the first conducting layer, and the dielectric properties of the insulating substrate. These parameter changes allow optimization of coupling without necessarily increasing substrate height
Solution Approach 2:
The patent shifts the coupling optimization from the vertical dimension (substrate height) to the horizontal dimension (conductor area and positioning). By adjusting the planar dimensions and relative positions of the feed-in unit and first conducting layer, effective coupling is achieved without increasing the substrate's vertical dimension
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the manufacturing process, reduces material consumption, and lowers costs while enabling adjustable resonant frequencies and circular polarization characteristics.
Implementation Method 1
the feed-in unit is electrically connected with the first conducting layer by means of electromagnetic coupling
Data Source
AI summary
The present invention is related to a microstrip antenna including an insulating substrate, a first conducting layer and a second conducting layer respectively located at two opposing surfaces of the insulating substrate, a non-conductive isolation zone defined in the second conducting layer, and a feed-in unit located within the con-conductive isolation zone. Thus, the non-conductive isolation zone separates the second conducting layer and the feed-in unit. During application, the feed-in unit is connected with a signal feed-in terminal, enabling the microstrip antenna to receive and transmit wireless signals. During fabrication of the microstrip antenna, it does not need to make a through hole on the insulating substrate, reducing the microstrip antenna process steps and material consumption and lowering the microstrip antenna fabrication cost.