Coupled Inductor Structure for Vertical Heat Dissipation
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Solution Overview
Problem
Conventional inductor components in switching power supply circuits face challenges in creating compact, efficient, and high current output power supply circuits due to their planar topology, which results in undesirable vertical heat flow and limited heat dissipation.
Innovation Solution
The development of a novel inductor device with a first face for coupling to a circuit board, featuring an inductive path with magnetic permeable material between the first and second faces, allowing for effective heat dissipation from the first face to the second face.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional planar inductor topology is used, then the inductor can be integrated into planar circuit applications, but heat dissipation is limited and vertical heat flow is undesirable
Solution Approach 1:
The patent transitions from conventional planar (2D) inductor topology to a three-dimensional structure where the inductive path extends vertically between a first face and a second face. This dimensional change enables heat to dissipate in the vertical direction through the thickness of the inductor component, rather than being constrained to horizontal dissipation only, thereby improving thermal management while maintaining planar circuit board compatibility.
2Power
If multiple turns of wire are wound into a coil to increase inductance, then magnetic field strength increases, but the structure becomes bulky and less suitable for compact designs
Solution Approach 1:
The patent embeds the inductive path within a magnetic core structure, where the conductive path is nested inside or integrated with the magnetic permeable material. This nesting approach allows the magnetic flux to be confined and concentrated within the core, achieving high inductance values without requiring multiple external wire turns, thus reducing the overall volume of the inductor component.
Solution Approach 2:
The inductive path is configured to extend in the vertical dimension between the first and second faces of the component, utilizing the thickness direction to create multiple effective turns of the magnetic path. This three-dimensional configuration achieves high inductance without increasing the planar footprint, enabling compact design while maintaining high power capability.
3Device complexity
If conventional inductor design is used, then simple structure is maintained, but heat dissipation efficiency is insufficient for high current applications
Solution Approach 1:
The patent introduces a three-dimensional heat dissipation pathway by extending the inductive path vertically between two faces of the component. This allows heat generated during high current operation to conduct through the thickness of the inductor to both the first and second faces, effectively doubling the heat dissipation surface area compared to conventional single-face designs, thereby improving energy loss management without significantly increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation and improves the efficiency of the inductor device, enabling the creation of compact and high current output power supply circuits while minimizing vertical heat flow.
Implementation Method 1
The magnetic permeable material may be disposed between the first face and the second face and carries magnetic flux associated with the first inductive path
Implementation Method 2
The second face supports dissipation of heat conveyed by the first inductive path from the first face to the second face
Data Source
AI summary
An inductor device includes a first face, a first inductive path, and magnetic permeable material. The first face couples the inductor device to a circuit board. The first inductive path extends between a first terminal on the first face to a second terminal on the first face. A portion of the first inductive path is exposed on a second face of the inductor device. The second face is disposed opposite the first face. The second face supports dissipation of heat conveyed by the first inductive path from the first face to the second face. The magnetic permeable material is disposed between the first face and the second face and carries magnetic flux associated with the first inductive path.