Coupled-Inductor Power Combiner for Smaller RF Splitter Footprint

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Solution Overview

Problem

The shrinking size of silicon components in electronic devices leads to non-scalable components like inductors in splitter/combiner circuitry, limiting the reduction of surface area and efficiency in communication circuitry.

Innovation Solution

Coupling inductors inductively in the splitter/combiner circuitry to reduce the overall surface area occupied, and adjusting capacitors to absorb parasitic capacitance and reduce component count.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If traditional splitter/combiner circuitry with separate inductors is used, then filtering function is achieved, but silicon footprint becomes non-scalable

Engineering Contradiction:
Improvesilicon footprintVSAvoidscalability
Core Design Contradiction:
Area of stationary objectVSAdaptability or versatility

Solution Approach 1:

The patent combines multiple inductor functions into a single shared inductor that is coupled to both capacitive dividers. This shared inductor performs the inductive function for both signal paths simultaneously, eliminating the need for separate inductors and reducing the overall silicon footprint while maintaining the filtering capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The shared inductor serves multiple functions: it provides inductive coupling for both capacitive dividers, enables filtering of out-of-band frequencies, and supports beam-forming operations. This multi-functional design allows the circuitry to maintain versatility while reducing component count and area.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If more components are used in splitter/combiner circuitry, then filtering performance is improved, but device complexity increases

Engineering Contradiction:
Improvefiltering performanceVSAvoidcomponent count
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

By merging the inductive functions into a single shared inductor, the patent reduces the total component count while preserving the filtering performance. The shared inductor works in conjunction with the capacitive dividers to achieve the necessary frequency rejection and signal separation.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts the common inductive function from the individual signal paths and places it in a shared position. This extraction eliminates redundant components and simplifies the overall circuit architecture while maintaining the essential filtering and signal processing functions.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces the silicon footprint and improves the efficiency of the splitter/combiner circuitry by minimizing surface area and optimizing signal transmission.

Implementation Method 1

a first inductor coupled to the first capacitive element and the third capacitive element, and a second inductor coupled to the second capacitive element and the fourth capacitive element, the first inductor and the second inductor being configured to inductively couple to one another

Methodology Applied
Scientific EffectInductive coupling: Electromagnetic Induction

Data Source

PatentUS20260106593A1High pass power combiner with coupled inductive elements
Publication Date: 2026.04.16 APPLE INC
  • US20260106593A1 patent drawing
  • US20260106593A1 patent drawing
  • US20260106593A1 patent drawing

AI summary

An electronic device includes multiple antennas to transmit one or more signals, and a transmitter electrically coupled to the antennas. The transmitter has splitter circuitry that receives an input signal and generates the signals. The splitter circuitry includes a pair of inductive elements that are inductively coupled together. The splitter circuitry includes capacitive elements to absorb parasitic input and output capacitance. In additional or alternative embodiments, the splitter circuitry may be in the form of combiner circuitry and disposed in a receiver of the electronic device.