Coupled Interstage Transformer for RF Die Coupling Without DC Blocks
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Solution Overview
Problem
Current RF power amplifier transistor products face challenges with increased manufacturing cost, complexity, and real estate consumption due to the need for physical connections and DC blocks, which also result in undesirable low frequency signals and stability issues.
Innovation Solution
The implementation of a device with a coupled interstage transformer using a metal submount, primary, and secondary interconnects that provide RF signal coupling between transistor dies without physical connections, utilizing electromagnetic coupling to eliminate the need for DC blocks and reduce low frequency signal transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If physical connections and DC blocks are used for interstage matching, then stable signal transmission is achieved, but manufacturing cost and device complexity increase
Solution Approach 1:
The patent replaces the mechanical/physical connection system (DC blocks, series capacitors, shunt L-C networks) with an electromagnetic field-based coupling system. The primary and secondary interconnects create electromagnetic coupling between transistor dies without requiring direct physical DC paths, thereby eliminating the need for DC blocks while maintaining signal transmission stability.
Solution Approach 2:
The patent introduces electromagnetic coupling as an intermediary mechanism between the driver stage and final stage. The electromagnetic field acts as a mediator that transfers RF signals between transistor dies without requiring direct physical connections, thus eliminating the need for physical DC blocks and series capacitors.
2Object-affected harmful factors
If DC blocks are implemented for stability, then low frequency signal suppression is achieved, but manufacturing cost increases
Solution Approach 1:
The patent replaces the mechanical DC block component with an electromagnetic coupling mechanism. The electromagnetic coupling inherently blocks DC and low frequency signals while allowing RF signals to pass, eliminating the need for separate DC block components and series capacitors, thereby reducing manufacturing cost.
Solution Approach 2:
The electromagnetic coupling system performs multiple functions simultaneously: it transfers RF signals between stages while inherently blocking DC and low frequency signals. The system serves itself by using the same coupling mechanism for both signal transmission and low frequency rejection, eliminating the need for separate DC blocking components.
3Adaptability or versatility
If shunt L-C networks are used for impedance matching, then band impedance is improved, but device real estate consumption increases
Solution Approach 1:
The patent merges the impedance matching function with the interconnect structure itself. The primary and secondary interconnects are configured to provide both signal coupling and impedance matching through their electromagnetic coupling characteristics, eliminating the need for separate shunt L-C network components and reducing device real estate consumption.
Solution Approach 2:
The electromagnetic coupling system performs multiple functions: it provides RF signal transmission, DC blocking, low frequency rejection, and impedance matching all through a single mechanism. This multi-functionality eliminates the need for separate components (DC blocks, series capacitors, shunt L-C networks), thereby reducing the overall device area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution decreases manufacturing costs and complexity, reduces device size, and enhances stability by effectively attenuating low frequency signals and improving band impedance matching, leading to a more stable and efficient RF power amplifier design.
Implementation Method 1
the set of primary interconnects and the set of secondary interconnects are configured to provide RF signal coupling between the first transistor die and the second transistor die by electromagnetic coupling
Data Source
AI summary
A device that includes a metal submount; a first transistor die arranged on said metal submount; a second transistor die arranged on said metal submount; a set of primary interconnects; and a set of secondary interconnects. Additionally, the set of primary interconnects and the set of secondary interconnects are configured to provide RF signal coupling between the first transistor die and the second transistor die by electromagnetic coupling.