Electromagnetically Coupled Patch Antenna Without Solder Joints
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Solution Overview
Problem
Existing patch antennas face challenges in designing and manufacturing due to vulnerabilities of solder joints under stress and difficulties in tuning antenna parameters, especially in applications with vibrations.
Innovation Solution
The development of electromagnetically coupled patch antennas using additive manufacturing processes, which eliminate solder joints and allow for fine-tuning of dielectric layer heights to control antenna parameters such as bandwidth and resonant frequency through varying dielectric constants and layer thicknesses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder joints are used to connect feed lines to patch antenna, then electrical connection is achieved, but reliability deteriorates under vibration stress
Solution Approach 1:
The patent removes solder joints entirely from the antenna structure, replacing them with electromagnetic coupling between the feed line and patch. This extraction of the vulnerable solder connection eliminates the reliability issue under vibration while maintaining electrical functionality through field coupling.
Solution Approach 2:
The patent replaces the mechanical solder joint connection with an electromagnetic coupling mechanism. Instead of physically soldering the feed line to the patch, the system uses electromagnetic fields to transfer energy, substituting a mechanical connection system with a field-based system that is immune to vibration stress.
2Adaptability or versatility
If dielectric layer heights are fixed during manufacturing, then manufacturing simplicity is maintained, but adaptability deteriorates for frequency tuning
Solution Approach 1:
The patent utilizes variations in dielectric layer heights and dielectric constants as tunable parameters to adjust antenna resonant frequency and bandwidth. By changing these physical dimensions and material properties, the antenna can be optimized for different frequency requirements without fundamental design changes.
Solution Approach 2:
The patent introduces adjustable dielectric layers that can be modified after manufacturing to tune antenna parameters. This dynamic capability allows the antenna to be adapted to different frequency requirements post-production, transforming a static structure into a tunable system.
3Reliability
If electromagnetic coupling is used instead of physical connections, then robustness against vibrations improves, but manufacturing precision requirements worsen
Solution Approach 1:
The patent compensates for manufacturing tolerances by using adjustable dielectric parameters (height, constant) that can be tuned to achieve the desired resonant frequency. This allows the system to accommodate variations in manufacturing precision while maintaining performance through parameter optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the robustness of antennas against vibrations and enables precise tuning of antenna characteristics, maintaining radiation performance and broad frequency operation without physical connections.
Implementation Method 1
electromagnetically coupled patch antennas... electromagnetically coupled between one or more feed line(s) and a patch that is radiating
Implementation Method 2
fine-tuning of dielectric layer heights to control antenna parameters such as bandwidth and resonant frequency through varying dielectric constants and layer thicknesses
Data Source
AI summary
An antenna assembly includes a conductive ground plane, a lower layer of dielectric material above the ground plane, and an upper layer of dielectric material above the lower layer of dielectric material. In an example, at least one of the lower or upper layers of dielectric material comprise dielectric foam. The antenna assembly further includes a conductive feed line between at least a section of the lower layer of dielectric material and the upper layer of dielectric material, and a conductive patch above the upper layer of dielectric material. In an example, a dielectric constant of the lower layer of dielectric material is at least 25%, or at least 50% more, or at least 100% more, or at least 200% more, or at least 500% more than a dielectric constant of the upper layer of dielectric material.