Coupled Substrate Semiconductor Package for Simpler Capacitor Assembly
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Solution Overview
Problem
Semiconductor device packages face increased complexity and manufacturing time due to the integration of multiple electrical components on a single high-density interconnect (HDI) PCB, which is expensive and difficult to troubleshoot.
Innovation Solution
A semiconductor device package design featuring two substrates, where semiconductor dies are connected to a first substrate and capacitors are connected to a second substrate, with both substrates being detachably coupled, allowing for separate processing and reducing the need for high-temperature soldering of capacitors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If all electrical components are mounted on a single high-density interconnect PCB, then the package can accommodate increased complexity and number of components, but the manufacturing complexity and cost increase significantly
Solution Approach 1:
The patent divides the electrical components into two separate groups: capacitors mounted on a first PCB and other electrical components (semiconductor dies, connectors, etc.) mounted on a second PCB. This segmentation allows each substrate to be manufactured and assembled independently, reducing the overall manufacturing complexity while accommodating a larger total number of components across both substrates.
2Quantity of substance
If all electrical components are mounted on a single high-density interconnect PCB, then the package can accommodate increased complexity and number of components, but the manufacturing time increases
Solution Approach 1:
By segmenting the component mounting into two separate PCB assemblies, the patent enables parallel manufacturing processes. The first PCB with capacitors and the second PCB with other components can be assembled simultaneously or in separate streamlined processes, then coupled together, thereby reducing total manufacturing time compared to assembling all components on a single complex PCB.
3Quantity of substance
If a single high-density interconnect PCB is used, then all electrical components can be integrated, but troubleshooting becomes difficult
Solution Approach 1:
The patent segments the electrical components onto two separate PCBs, which isolates potential sources of failure. When troubleshooting, technicians can independently diagnose and test each PCB assembly without having to navigate a single complex board with all components. This modular arrangement makes detecting and measuring problems significantly easier while still integrating all required electrical components into the final package.
4Quantity of substance
If capacitors are soldered to the same substrate as semiconductor dies, then high-temperature soldering is required, but this increases manufacturing complexity and cost
Solution Approach 1:
The patent segments capacitors onto a separate first PCB from the semiconductor dies on the second PCB. This allows capacitors to be soldered using lower-temperature processes appropriate for their temperature ratings, while semiconductor dies can undergo high-temperature soldering on the second substrate. This eliminates the need for all components to withstand high-temperature soldering, simplifying manufacturing and reducing costs while maintaining integration of all electrical components.
Data Source
AI summary
A semiconductor device package includes a first substrate extending along a first central plane, and a second substrate electrically connected to the first substrate and extending along a second central plane that is substantially parallel with and offset from the first central plane of the first substrate. One or more capacitors are electrically and mechanically connected to the second substrate via one or more leads. All of the one or more capacitors are positioned at the second substrate. All of the capacitors being positioned at the second substrate, reduces the complexity of and time required to manufacture the semiconductor device package.