Coupler with Segmented Resistive Film for Signal Attenuation

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Solution Overview

Problem

Conventional couplers with integrated resistor elements for attenuating signals suffer from significant frequency-dependent attenuation due to the skin effect, leading to high-frequency loss and increased contact resistance between conductive and resistive films, which complicates circuit design, especially in broadband wireless communication devices.

Innovation Solution

The coupler design features a substrate with a main line and a sub line where the resistive film is partially exposed, allowing the conductive film to be free from full coverage, reducing contact resistance and frequency-dependent attenuation by ensuring the resistive film contacts the conductive film only at upper and end surfaces, and using an insulating film to prevent oxidation and enhance adhesion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the resistive film is formed on the entire surface of the substrate including below the conductive film, then the manufacturing process is simplified, but the skin effect causes significant frequency-dependent attenuation and high-frequency loss

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidfrequency-dependent attenuation
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The resistive film is segmented into a bridge portion that contacts the conductive film and non-bridge portions that do not contact the conductive film. This segmentation allows the resistive film to provide attenuation only where needed (at the bridge portion) while avoiding the skin effect problems that occur when the resistive film is present below the entire conductive film structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The resistive film is positioned to have different functions in different locations: at the bridge portion, it provides attenuation and impedance control by contacting the conductive film, while in non-bridge portions, it is removed or not formed to prevent frequency-dependent attenuation. This local differentiation resolves the contradiction between manufacturing simplicity and performance.

Inventive Principle:
Principle #3Local quality

2Loss of energy

If the resistive film contacts the conductive film only at the end surface, then the frequency-dependent attenuation is reduced, but the contact resistance increases significantly

Engineering Contradiction:
Improvefrequency-dependent attenuationVSAvoidcontact resistance
Core Design Contradiction:
Loss of energyVSReliability

Solution Approach 1:

The contact between the resistive film and conductive film is extended from a single-point end surface contact to a multi-dimensional contact involving both the upper surface and end surface of the conductive film. This dimensional expansion of the contact area reduces contact resistance while maintaining the benefit of reduced frequency-dependent attenuation compared to full surface contact.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Stability of the object's composition

If the conductive film is fully covered by the resistive film, then the impedance control is improved, but the contact resistance between conductive and resistive films increases

Engineering Contradiction:
Improveimpedance controlVSAvoidcontact resistance
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

Instead of fully covering the conductive film with the resistive film (excessive action), the resistive film is applied partially only at the bridge portion where impedance control is needed. This partial application maintains adequate impedance control while minimizing the contact area and thus reducing contact resistance between the conductive and resistive films.

Inventive Principle:
Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces frequency-dependent attenuation and contact resistance, stabilizes high-frequency characteristics, and prevents resistive film degradation, resulting in improved performance and reliability for wireless communication devices.

Implementation Method 1

A current signal is attenuated more significantly in the resistive film than in the conductive film

Methodology Applied
Scientific EffectResistive dissipation: Joule Heating

Implementation Method 2

The flowing of the current signal in the resistive film is caused by so-called a skin effect. The skin effect has frequency characteristics, so that the attenuation amount differs depending on a frequency of the current signal.

Methodology Applied
Scientific EffectSkin effect: Skin Effect

Implementation Method 3

the resistive film is covered by the insulating film before the formation of the conductive film, thereby making it possible to prevent the resistive film from being oxidized during a manufacturing process

Methodology Applied
Scientific EffectOxidation prevention: Oxidation

Data Source

PatentUS9263786B2Coupler, electronic component, and manufacturing method for electronic component
Publication Date: 2016.02.16 TDK CORP
  • US9263786B2 patent drawing
  • US9263786B2 patent drawing
  • US9263786B2 patent drawing

AI summary

A coupler includes an input terminal and an output terminal which are provided on a substrate, a main line provided on the substrate and having one end connected to the input terminal and the other end connected to the output terminal, and a sub line including a conductive film and a resistive film which are provided on the substrate and electromagnetically coupled to the main line at a part of the conductive film. The conductive film has wiring patterns. The resistive film includes a resistive film pattern having an end portion fitted into between the wiring pattern and substrate and an end portion fitted into between the wiring pattern and substrate. The end portions and each contact the conductive film at least at its upper surface and end surface.