Coupling Device Floating Portion Thermal Connection

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Solution Overview

Problem

Current thermal management solutions for high-power optical transceivers in dense optical units, such as those in Radio Access nodes, face challenges in efficiently dissipating heat due to the build-up of heat in and around connectors, particularly in active cable assemblies, which limits the number of transceivers that can be accommodated in a given space without increasing the rack unit thickness.

Innovation Solution

A coupling device with movable floating portions that extend over open areas of cages, transitioning from a non-thermal to a thermal connection with a heat sink upon insertion of a signal connector, allowing for efficient heat dissipation without requiring manual assembly or additional components, and enabling a higher density of transceivers within the same space.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heat sinks are used to dissipate heat from connectors, then heat dissipation is improved, but device complexity and assembly complexity increase

Engineering Contradiction:
Improveheat dissipationVSAvoidassembly complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The coupling device merges the mechanical coupling function with the thermal management function into a single integrated component. The coupling device includes a body that couples the connector to the cage and simultaneously includes a heat dissipation element that thermally connects to the connector, eliminating the need for separate heat sink components and reducing assembly complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The coupling device performs dual functions automatically: mechanical coupling and thermal management. The heat dissipation element is thermally connected to the connector through the coupling device body, which naturally conducts heat away from the connector during normal operation without requiring additional active components or complex assembly procedures.

Inventive Principle:
Principle #25Self-service

2Productivity

If more transceivers are placed in a given rack space, then productivity is improved, but heat build-up increases

Engineering Contradiction:
Improvetransceiver densityVSAvoidheat build-up
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The thermal management solution is segmented and integrated at the connector level rather than requiring centralized cooling systems. Each coupling device independently manages heat from its associated connector, allowing multiple transceivers to be densely packed without cumulative heat build-up interfering with other components.

Inventive Principle:
Principle #1Segmentation

3Temperature

If custom heat sinks are designed for each connector, then heat dissipation is improved, but manufacturing complexity increases

Engineering Contradiction:
Improveheat dissipationVSAvoidmanufacturing complexity
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The coupling device is designed as a universal component that performs both mechanical coupling and thermal management functions. The body of the coupling device serves as both the mechanical interface between connector and cage and as the heat dissipation element, eliminating the need for custom-designed heat sinks for each connector type.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances thermal management by allowing for a higher number of transceivers in a compact space, reducing assembly complexity, and improving heat dissipation efficiency, enabling the use of higher power connectors like SFP28 without increasing the rack unit thickness, while also reducing the need for custom heat sinks and assembly labor.

Implementation Method 1

In the first position, the floating portion is not in thermal connection with the heat sink, and when in the second position, the floating portion is in thermal connection with the heat sink

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250107028A1An Interface Module and a Coupling Device
Publication Date: 2025.03.27 TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
  • US20250107028A1 patent drawing
  • US20250107028A1 patent drawing
  • US20250107028A1 patent drawing

AI summary

An interface module (200) comprises a set of cages (6), each cage configured to guide a signal connector (200) towards an interface (8) for connection with the signal connector. Each cage of the set of cages comprises an open area (17) facing a heat sink. A coupling device is configured to attach to the set of cages and extend over the open area of the cages. The coupling device comprises a floating portion for each cage. The floating portion is configured to move from a first position to a second position upon insertion of the signal connector into the cage. In the first position, the floating portion is not in thermal connection with the heat sink, and wherein, when in the second position, the floating portion is in thermal connection with the heat sink.