Coupling Inductor Winding Layout for Direct Heat Dissipation
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Solution Overview
Problem
Conventional voltage regulators in power systems face challenges with thermal resistance between the inductor and switching elements, limiting effective heat transfer and power density improvement in modern data centers and AI infrastructures.
Innovation Solution
A coupling inductor design with a winding assembly exposed on a magnetic core, where a portion is configured as a heat dissipation part, directly connected to a switching device, reducing thermal resistance and enhancing heat dissipation performance and power density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the inductor is integrated with switching elements in a conventional voltage regulator topology, then the power conversion function is achieved, but thermal resistance prevents effective heat transfer from the inductor to the cooling system
Solution Approach 1:
The patent merges the inductor with the switching device by directly coupling the inductor winding to the switching device terminal, creating an integrated structure where the inductor body serves as part of the heat dissipation path. This integration eliminates thermal interface resistance and enables direct heat transfer from the inductor to the switching device and subsequently to the cooling system.
Solution Approach 2:
The inductor structure is designed to serve multiple functions: it performs the electromagnetic energy storage function of an inductor while simultaneously acting as a heat dissipation component. The inductor body is configured to conduct heat from its winding to the switching device, enabling it to function both as an energy storage element and a thermal management component.
2Temperature
If thermal resistance is reduced through direct contact between inductor and switching device, then heat dissipation performance is enhanced, but device complexity increases due to integration requirements
Solution Approach 1:
The patent combines the inductor and switching device into a single integrated component structure. The inductor winding is directly coupled to the switching device terminal, eliminating the need for separate mounting and connection interfaces. This merger reduces the number of discrete components and assembly steps while achieving superior thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat generated by the switching device, significantly improving thermal performance and power density by reducing thermal resistance and increasing heat dissipation efficacy.
Implementation Method 1
The first power winding and the second power winding are partially disposed within the magnetic core. A shared flux path is provided between the first power winding and the second power winding.
Implementation Method 2
A portion of the first power winding is exposed on the top surface of the magnetic core and configured as a first heat dissipation part. A portion of the second power winding is exposed on the top surface of the magnetic core and configured as a second heat dissipation part. Since the thermal resistance is greatly reduced, the heat dissipation performance and the power density of the coupling inductor can be effectively enhanced.
Data Source
AI summary
A coupling inductor and a power conversion module with the coupling inductor are provided. The coupling inductor includes a magnetic core and a winding assembly. The winding assembly includes a first power winding and a second power winding. A shared flux path is provided between the first power winding and the second power winding. Two opposite terminals of the first power winding are exposed on the bottom surface of the magnetic core. A portion of the first power winding is exposed on the top surface of the magnetic core and configured as a first heat dissipation part. Two opposite terminals of the second power winding are exposed on the bottom surface of the magnetic core. A portion of the second power winding is exposed on the top surface of the magnetic core and configured as a second heat dissipation part.