Cover-Type AiP Module for Compact Wireless BMS Packaging
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Solution Overview
Problem
The size of wireless BMS modules increases due to the installation of antennas, necessitating a need for a module that reduces size while maintaining functionality.
Innovation Solution
An antenna-in-package (AiP) module with a cover-type antenna, where one chipset is embedded and another is disposed on a substrate, utilizing a radiating unit shaped as a cover to minimize spatial requirements, and incorporating shielding layers and walls to reduce interference and interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an antenna is mounted on a wireless BMS to enable wireless communication, then wireless communication functionality is achieved, but the size of the BMS module increases
Solution Approach 1:
The patent combines the antenna with the substrate by forming the antenna directly on the substrate surface, merging two previously separate components (antenna and substrate) into a single integrated structure. This eliminates the need for additional antenna mounting space and reduces the overall module size while maintaining wireless communication functionality
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for the electronic components, acts as the mounting platform for the antenna, and functions as the radiating element for wireless communication. This multi-functionality eliminates the need for separate antenna structures and reduces the overall module footprint
Data Source
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AI summary
An antenna-in-package (AiP) module according to one embodiment of the present invention comprises a substrate, a first chipset embedded in the substrate, a second chipset disposed on the substrate, and a radiating unit electrically connected to the second chipset, wherein the radiating unit is shaped as a cover that covers the substrate.