Electronic Device Cover Air Return Channel for Corrosion Control
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Solution Overview
Problem
Conventional electronic device designs face challenges in maintaining effective heat dissipation while preventing dust and corrosion in harsh environments, as dust filters can block airflow and lead to corrosion when not properly maintained.
Innovation Solution
An electronic device cover with a baffle plate and air return channel configuration that recirculates hot air from the exhaust channel to the intake channel, balancing air temperature and reducing humidity, thereby enhancing corrosion resistance without compromising heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a dust filter is disposed at the air intake vent for dust prevention, then dust prevention performance is improved, but heat dissipation performance deteriorates due to increased heat dissipation drag
Solution Approach 1:
The patent extracts the dust filtering function from the main air intake path by introducing a separate air return channel that communicates with both the air exhaust channel and air intake channel. This allows the system to achieve dust prevention through air circulation without blocking the primary heat dissipation path, thereby resolving the contradiction between dust prevention and heat dissipation performance.
Solution Approach 2:
The air return channel acts as an intermediary component that connects the exhaust air and intake air channels. It mediates between the need for dust filtration and heat dissipation by allowing processed air to return to the intake channel without creating resistance in the main exhaust path, thus maintaining both dust prevention and heat dissipation efficiency.
2Reliability
If a dust filter is used for dust prevention, then dust entry is reduced, but the device requires periodic maintenance and cleaning
Solution Approach 1:
The air return channel creates a self-circulating system where exhaust air is continuously returned to the intake channel. This self-service mechanism naturally prevents dust accumulation without requiring external filtration components that would need maintenance, as the circulating air flow keeps the system self-cleaning.
3Loss of energy
If cold air is continuously supplied to the chassis, then heat dissipation is improved, but relative humidity increases causing corrosion of electronic components
Solution Approach 1:
The patent changes the temperature parameter of the air supplied to the chassis by introducing warmer return air through the air return channel. This parameter change raises the air temperature slightly, which reduces relative humidity and prevents corrosion, while the overall heat dissipation function is maintained through the balanced air circulation system.
4Object-affected harmful factors
If the air intake temperature is increased to reduce humidity, then corrosion resistance is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The patent applies partial action by only partially mixing return air with intake air through the air return channel. This partial mixing slightly increases the air temperature enough to reduce humidity and prevent corrosion, while maintaining sufficient temperature differential for effective heat dissipation, thus balancing both requirements without excessive temperature increase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the risk of corrosion and maintains heat dissipation efficiency by balancing air temperature and humidity within the device, even in harsh environments.
Implementation Method 1
an air return channel is further disposed inside the electronic device cover, and the air return channel is configured to communicate the air exhaust channel and the air intake channel, so that a part of hot return air in the air exhaust channel may enter the air intake channel
Data Source
AI summary
An electronic device cover is configured to accommodate an electronic device. A first air intake window and a first air exhaust window are disposed on the electronic device cover. The first air intake window is configured to communicate with an air intake vent of the electronic device to form an air intake channel, and the first air exhaust window is configured to communicate with an air exhaust vent of the electronic device to form an air exhaust channel. An air return channel is disposed inside the electronic device, and the air return channel is configured to communicate the air exhaust channel and the air intake channel.