Cover Assembly for Thermal Processing Gas Delivery
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Solution Overview
Problem
Conventional thermal processing chambers face issues with temperature uniformity and chamber downtime due to outgassing of materials from substrates, which leads to deposition on reflector plates and temperature measurement interference, requiring frequent manual cleaning and increased maintenance.
Innovation Solution
A cover assembly is positioned between the substrate and the reflector plate within the thermal processing chamber, featuring ports to deliver thermal processing gas and reduce deposition, while maintaining temperature uniformity and reducing chamber downtime through improved thermal processing gas management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal processing chambers are used without a cover assembly, then the chamber structure is simple, but temperature uniformity deteriorates and deposition on reflector plates increases
Solution Approach 1:
A cover assembly is introduced as an intermediary component between the substrate and reflector plate. This cover delivers thermal processing gas to the substrate surface and prevents outgassed material from depositing on the reflector plate, thereby improving temperature uniformity without significantly complicating the overall chamber structure
Solution Approach 2:
The cover assembly extracts and removes outgassed material from the path between the substrate and reflector plate by delivering thermal processing gas through ports, preventing deposition on the reflector plate and maintaining temperature uniformity
2Reliability
If manual cleaning of reflector plates is performed frequently, then deposition on components is reduced, but chamber downtime increases
Solution Approach 1:
The cover assembly converts the harmful outgassed material into a beneficial flow pattern by directing thermal processing gas through ports to the substrate surface. This creates a protective gas flow that prevents deposition on the reflector plate, turning the potential contamination problem into a solution that reduces cleaning frequency
Solution Approach 2:
The cover assembly acts as an intermediary barrier that intercepts outgassed material before it can deposit on the reflector plate. By delivering thermal processing gas through the cover ports, it creates a protective atmosphere that prevents contamination, thereby reducing the need for frequent manual cleaning and chamber downtime
3Object-generated harmful factors
If thermal processing gas is delivered through cover ports, then deposition on reflector plate is reduced, but device complexity increases
Solution Approach 1:
The cover assembly serves as an intermediary component that delivers thermal processing gas through ports to the substrate surface. This simple structural addition creates an effective gas flow pattern that prevents outgassed material from reaching the reflector plate, reducing deposition without requiring complex mechanisms
Solution Approach 2:
The cover assembly extracts harmful outgassed material from the processing environment by establishing a directed gas flow through its ports. This simple extraction mechanism prevents deposition on the reflector plate without adding significant complexity to the chamber design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances temperature uniformity across substrates, reduces chamber downtime, and lowers maintenance costs by minimizing deposition on chamber components, thereby improving the overall efficiency and cost-effectiveness of thermal processing.
Implementation Method 1
RTP systems usually include a heating lamps which radiatively heat the substrate through a light-transmissive window
Implementation Method 2
A cover is disposed between the substrate and the reflector plate within the thermal processing chamber. A gas source is configured to deliver a thermal processing gas to the cover during processing
Data Source
AI summary
Embodiments of the present disclosure provide a cover assembly that includes a cover disposed between a device side surface of a substrate and a reflector plate, which are disposed within a thermal processing chamber. The presence of the cover between the device side surface of a substrate and a reflector plate has many advantages over conventional thermal processing chamber designs, which include an improved temperature uniformity during processing, a reduced chamber down time and an improved cost-of-ownership of the processes performed in the thermal processing chamber. In some configurations, the cover includes two or more ports that are formed therein and are positioned to deliver a gas, from a space formed between the reflector plate and the cover, to desired regions of the substrate during processing to reduce the temperature variation across the substrate.