Cover Assembly Impedance Control Structure High-Frequency Data

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

In high-frequency data transmission, existing connection devices and reinforcements can deteriorate signal quality and transmission performance due to impedance mismatch and mechanical instability, leading to signal reflection and reduced reliability.

Innovation Solution

A cover assembly with an impedance control structure and high permittivity insulation material is used to adjust the impedance of electrical conductors, incorporating a protective cover and contact carrier with embedded conductors and spring beams, and featuring recesses and lead-through holes to minimize impedance mismatch and enhance mechanical stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If connection devices and reinforcements are used to establish permanent bonds between transmission line components, then mechanical stability and electrical contact reliability are improved, but signal quality and transmission performance deteriorate due to impedance mismatch

Engineering Contradiction:
Improveelectrical contact reliabilityVSAvoidsignal quality deterioration
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

An impedance control structure is introduced as an intermediary element between the electrical conductors and the bonding region. This structure serves as a mediator that gradually transitions the impedance from the conductor's original impedance to the bonded impedance, preventing abrupt impedance mismatch and reducing signal reflection while maintaining reliable electrical contact.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The impedance control structure utilizes a material with a specific relative permittivity that differs from both the surrounding insulation material and the bonding reinforcement. By changing the dielectric parameter (permittivity) in the bonding region, the impedance is continuously adjusted along the transmission path, eliminating abrupt impedance discontinuities and improving signal quality.

Inventive Principle:
Principle #35Parameter changes

2Stability of the object's composition

If connection devices and reinforcements are used to establish permanent bonds between transmission line components, then mechanical stability is improved, but transmission performance deteriorates due to impedance mismatch

Engineering Contradiction:
Improvemechanical stabilityVSAvoidtransmission performance
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The impedance control structure acts as a transition zone that mediates between the mechanical reinforcement needed for stable bonding and the electrical performance required for high-frequency signal transmission. It allows the bonding reinforcement to provide mechanical stability while the impedance control structure maintains transmission performance by managing impedance transitions.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The impedance control structure is localized specifically at the bonding region where impedance mismatch occurs. The material properties (relative permittivity) are changed only in this specific local area, allowing the rest of the transmission line to maintain its original characteristics while addressing the impedance issue at the critical bonding point.

Inventive Principle:
Principle #3Local quality

3Object-affected harmful factors

If impedance control structure with high permittivity insulation material is introduced to adjust impedance, then signal integrity is improved, but device complexity increases

Engineering Contradiction:
Improvesignal reflectionVSAvoidstructure complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The impedance control structure is merged with the bonding reinforcement into a single integrated component. Instead of being separate elements, the impedance control function and mechanical bonding function are combined in one structure, reducing the number of discrete parts and simplifying the overall device while maintaining signal integrity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The impedance control structure serves multiple functions simultaneously: it provides impedance transition to reduce signal reflection, offers mechanical support for the bonded conductors, and maintains the structural integrity of the connection device. This multi-functionality reduces the need for additional components and simplifies the overall design.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces signal reflection and improves signal integrity and transmission reliability by matching impedance and providing mechanical reinforcement, ensuring stable high-frequency data transmission.

Implementation Method 1

The impedance control structure adjusts an impedance of the bond location to a predefined value

Methodology Applied
Scientific EffectImpedance control: Electrical Impedance Tomography

Implementation Method 2

A cover assembly includes a protective cover having an impedance control structure and a plurality of electrical conductors conducting electrical signals of a high-frequency data transmission

Methodology Applied
Scientific EffectHigh permittivity insulation: Dielectric Permittivity

Data Source

PatentUS11355889B2Cover assembly with at least one impedance control structure
Publication Date: 2022.06.07 TE CONNECTIVITY GERMANY GMBH
  • US11355889B2 patent drawing
  • US11355889B2 patent drawing
  • US11355889B2 patent drawing

AI summary

A cover assembly includes a protective cover having an impedance control structure and a plurality of electrical conductors conducting electrical signals of a high-frequency data transmission. The electrical conductors extend through the protective cover in a transmission direction and are overlappingly bonded to each other at a bond location located within the protective cover. The impedance control structure adjusts an impedance of the bond location to a predefined value.