Semiconductor Cover Fixation via Sealing Resin Embedding
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Solution Overview
Problem
Conventional semiconductor devices require dedicated fixation mechanisms and members, limiting downsizing, increasing material costs, and introducing foreign particles due to adhesive application processes.
Innovation Solution
A semiconductor device design where a convex portion on the cover is embedded into a cured sealing member to fix the cover to the container body, eliminating the need for dedicated fixation mechanisms and members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dedicated fixation mechanism and fixation member are used to fix the cover to the container body, then the fixation reliability is improved, but the device complexity and size increase
Solution Approach 1:
The invention extracts the dedicated fixation mechanism and fixation member from the system, eliminating these separate components. Instead, the cover is fixed to the container body through the sealing resin itself, which serves both sealing and fixation functions simultaneously, thereby reducing device complexity while maintaining fixation reliability
Solution Approach 2:
The invention merges the sealing function and fixation function into a single component - the sealing resin. The sealing resin not only provides sealing between the cover and container body but also serves as the fixation medium through which the convex portion is embedded, eliminating the need for separate fixation mechanisms
2Reliability
If a dedicated fixation mechanism and fixation member are used to fix the cover to the container body, then the fixation reliability is improved, but the volume of the container body increases
Solution Approach 1:
By removing the dedicated fixation mechanism and fixation member from the system, the invention eliminates the additional space these components would occupy. The cover is fixed directly through the sealing resin, allowing for a more compact container body design without compromising fixation reliability
Solution Approach 2:
The sealing resin performs dual functions as both sealant and fixation medium. The convex portion on the cover is embedded in the sealing resin, which cures to provide secure fixation without requiring additional fixation components that would increase the container body volume
3Device complexity
If an adhesive agent is used to fix the cover to the container body, then the fixation is simplified, but the number of processes and material cost increase
Solution Approach 1:
The invention merges the sealing resin with the fixation function, eliminating the need for separate adhesive agents. The sealing resin itself serves as the fixation medium through which the convex portion is embedded and cured, reducing material cost while maintaining fixation simplicity
Solution Approach 2:
The sealing resin performs self-service by simultaneously providing sealing and fixation functions. The convex portion on the cover is embedded in the sealing resin, which then cures to fix the cover in place, eliminating the need for additional adhesive materials and reducing overall material cost
4Reliability
If adhesive agent application and thermal cure processes are performed to fix the cover, then the fixation is achieved, but the manufacturing time increases and foreign particles may enter
Solution Approach 1:
The invention combines the sealing and fixation processes into a single step using the sealing resin. The convex portion is embedded in the sealing resin during the sealing process, and the curing of the sealing resin simultaneously achieves both sealing and fixation, eliminating the need for separate adhesive application and thermal cure processes, thereby reducing manufacturing time and preventing foreign particle contamination
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables downsizing, reduces material costs, and minimizes foreign particle entry by simplifying the fixation process and eliminating the need for adhesives, while providing reliable thermal stress management for wide bandgap semiconductors.
Implementation Method 1
the cover is fixed to the container body only by embedding at least a tip portion of the convex portion in the sealing member which has been cured
Data Source
AI summary
An object is to provide a technique capable of fixing a cover to a container body without using a dedicated fixation mechanism and fixation member. A semiconductor device includes: a container body having a space with an opening; a semiconductor element disposed in the space in the container body; a sealing member disposed in the space in the container body to cover the semiconductor element; and a cover covering the opening of the container body, wherein a convex portion protruding into the space is provided on the cover, and the cover is fixed to the container body only by embedding at least a tip portion of the convex portion in the sealing member which has been cured.