Injection Molded Cover Device Hooking Portion Design

Solution Overview

Problem

The existing methods for manufacturing protective cases for electronic devices using injection molding often result in damage to the hooking parts during the take-out process due to weight distribution issues, compromising the rigidity and hooking force of the cover device.

Innovation Solution

A cover device design featuring a mold with a specific geometry that reduces weight on the hooking portion, including a first plate with perpendicular sidewalls forming a recess for the electronic device, and an extended hooking portion to enhance coupling and protection without damaging the hooking parts during injection molding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the hooking portion is increased in size to improve coupling between the cover device and electronic device, then the hooking force is improved, but the weight on the hooking portion during take-out increases causing damage

Engineering Contradiction:

Improvehooking forceVSAvoiddamage to hooking portion

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The mold is divided into two separate cores (first core and second core) that can move independently. This segmentation allows the second core to transfer in a direction parallel to the hooking portion, reducing weight concentration on the hooking area during take-out while still supporting the overall structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The take-out process is changed from a vertical direction (perpendicular to the hooking portion) to a horizontal direction (parallel to the hooking portion). This dimensional change in the transfer direction of the second core eliminates the concentration of weight on the hooking portion, preventing damage while maintaining the enlarged hooking structure for improved coupling.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Object-affected harmful factors

If elastic or ductile material is used to prevent damage during take-out, then the hooking portion damage is prevented, but the rigidity of the cover device cannot be secured

Engineering Contradiction:

Improvedamage to hooking portionVSAvoidrigidity

Core Design Contradiction:

Object-affected harmful factorsVSStrength

Solution Approach 1:

The solution replaces the material-based approach (using elastic/ductile materials) with a process-based approach (mold core transfer mechanism). By substituting the mechanical take-out process with a controlled core transfer system, the patent enables the use of rigid materials that provide both the necessary rigidity for the cover device and resistance to damage during take-out.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Object-affected harmful factors

If the size of the hooking portion is decreased to reduce weight during take-out, then the damage during take-out is reduced, but the coupling between cover device and electronic device is weakened

Engineering Contradiction:

Improvedamage to hooking portionVSAvoidcoupling strength

Core Design Contradiction:

Object-affected harmful factorsVSStrength

Solution Approach 1:

The mold is divided into two separate cores (first core and second core) that can move independently. This segmentation allows the second core to transfer in a direction parallel to the hooking portion, reducing weight concentration on the hooking area during take-out while still supporting the overall structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The take-out process is changed from a vertical direction (perpendicular to the hooking portion) to a horizontal direction (parallel to the hooking portion). This dimensional change in the transfer direction of the second core eliminates the concentration of weight on the hooking portion, preventing damage while maintaining the enlarged hooking structure for improved coupling.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11432630B2Cover device for holding electronic device

Publication Date: 2022.09.06 SAMSUNG ELECTRONICS CO LTD

AI summary

A cover device according to an embodiment of the present invention, may include a first plate including a first surface and a second surface facing away from the first surface, and being substantially rectangular, the first plate including a first edge having a first length and extending in a first direction, a second edge having a second length longer than the first length and extending in a second direction orthogonal to the first direction, a third edge parallel to the first edge, having the first length, and extending in the first direction from the second edge, and a fourth edge parallel to the second edge, having the second length, and extending from the first edge in the second direction, a first sidewall perpendicular to the first surface and extending from the first edge, a second sidewall perpendicular to the first surface and the first sidewall and extending from the second edge, a third sidewall perpendicular to the first surface and the second sidewall and extending from the third edge, and a fourth sidewall perpendicular to the first surface and the third sidewall and extending from the fourth edge, wherein the first surface, the first sidewall, the second sidewall, the third sidewall and the fourth sidewall together may form a recess for receiving and holding the electronic device, and the first surface may include at least one parting line having a third length longer than the first length and shorter than the second length and extending in the second direction.