Cover-glass-free Array Camera with Opaque Light Shields
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Solution Overview
Problem
Array cameras face challenges in achieving accurate depth perception due to crosstalk between individual cameras, which affects image quality and registration accuracy, and existing manufacturing methods are costly and inefficient for large form factors.
Innovation Solution
A cover-glass-free array camera design with individually light-shielded cameras, featuring a lens array bonded to a silicon substrate with opaque material surrounding each imaging objective to prevent crosstalk, manufactured using wafer-level processes for improved registration and reduced size and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional single camera manufacturing methods are used, then cost-effectiveness is achieved for small form factor, but manufacturing precision and registration accuracy deteriorate for array cameras
Solution Approach 1:
The patent merges multiple individual camera manufacturing processes into a single wafer-level batch process. Multiple imaging objectives are fabricated simultaneously on a common substrate with precise relative positioning, eliminating the need for separate manufacturing and assembly steps for each camera. This merging approach achieves high registration accuracy while maintaining cost-effectiveness through economies of scale.
Solution Approach 2:
The patent creates a universal manufacturing platform that can produce multiple cameras with precise relative positioning in a single process. The wafer-level fabrication system serves as a multi-functional platform that simultaneously manufactures multiple imaging objectives, common substrates, and integrated assemblies, replacing multiple specialized manufacturing lines.
2Area of stationary object
If individual cameras are closely spaced to reduce form factor, then device size is reduced, but crosstalk between cameras increases
Solution Approach 1:
The patent introduces light-shielding structures as intermediary elements positioned between adjacent imaging objectives. These shields act as mediators that block stray light paths while maintaining the compact physical spacing of cameras. The light-shielding layers are integrated into the wafer-level fabrication process, creating effective optical isolation without increasing the overall array footprint.
3Object-generated harmful factors
If cover glass is added to prevent light leakage, then crosstalk is reduced, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts the light-shielding function from the traditional cover glass component and integrates it directly into the substrate and lens assembly. Instead of adding a separate cover glass layer, the light-shielding structures are formed as part of the wafer-level fabrication process, eliminating the need for additional components and assembly steps while achieving the same optical isolation effect.
4Manufacturing precision
If wafer-level manufacturing is used for array cameras, then manufacturing precision is improved, but ease of manufacture deteriorates due to process complexity
Solution Approach 1:
The patent segments the wafer-level manufacturing process into distinct functional layers and fabrication stages that can be independently optimized and controlled. The process is divided into substrate preparation, lens fabrication, light-shielding structure formation, and assembly stages, each with standardized procedures. This segmentation makes the complex wafer-level process more manageable while maintaining the high precision benefits of batch manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution minimizes light leakage between cameras, enhancing image quality and registration accuracy while reducing manufacturing costs and size, effectively addressing the limitations of traditional array camera designs.
Implementation Method 1
a first opaque material between each of the imaging objectives to prevent crosstalk between individual cameras
Data Source
AI summary
A cover-glass-free array camera with individually light-shielded cameras includes an image sensor array having a plurality of photosensitive pixel arrays formed in a silicon substrate, and a lens array bonded to the silicon substrate, wherein the lens array includes (a) a plurality of imaging objectives respectively registered to the photosensitive pixel arrays to form respective individual cameras therewith, and (b) a first opaque material between each of the imaging objectives to prevent crosstalk between individual cameras.