Optically-Transparent Cover Groove Suppresses Light Reflection
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Solution Overview
Problem
In semiconductor devices with light emitting elements mounted on substrates, the light emission efficiency is reduced due to reflection and transmission issues caused by the optically-transparent cover, particularly at the peripheral edges where the adhesive and cover interface affects light emission angles and transmission.
Innovation Solution
A semiconductor device design featuring an optically-transparent cover with a groove part to suppress light reflection, formed on the side facing the light emitting element, and a manufacturing method that includes forming this groove part to enhance light emission efficiency, along with anodic bonding to prevent adhesive stickout and ensure clean sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an optically-transparent cover is used to seal the light emitting element, then the light emitting element is protected and sealed, but light reflection increases at the peripheral edge reducing light emission efficiency
Solution Approach 1:
The patent applies a reflective prevention structure (such as a reflective prevention film or groove) specifically at the peripheral edge of the cover where reflection occurs, while keeping the rest of the cover surface optically transparent. This local modification addresses the reflection problem at the critical bonding area without compromising the overall transparency and sealing function of the cover.
Solution Approach 2:
The patent introduces an intermediary structure (reflective prevention film or groove) between the light emitting element and the cover's peripheral edge. This intermediary structure mediates the interaction between light and the cover boundary, preventing harmful reflection while maintaining the seal. The adhesive layer also acts as an intermediary to improve light extraction at the bonding interface.
2Reliability
If adhesive is used to bond the cover to the frame body, then the cover is securely sealed, but adhesive stickout occurs affecting light transmission
Solution Approach 1:
The patent extracts or removes the problematic adhesive stickout from the optical path by controlling the adhesive application and curing process. The reflective prevention structure is also applied to remove or mitigate the harmful effect of any remaining adhesive residue at the peripheral edge, separating the bonding function from the optical transmission function.
Solution Approach 2:
The patent applies different properties to different regions: the adhesive provides strong bonding at the bonding interface, while the reflective prevention structure at the peripheral edge addresses light reflection and transmission issues. This local differentiation allows the adhesive to fulfill its bonding purpose without compromising light transmission in the critical optical areas.
3Device complexity
If the cover is bonded directly to the frame body without additional structures, then the structure is simple, but light reflection at the bonding interface increases
Solution Approach 1:
The patent adds a reflective prevention structure only at the critical peripheral edge area where light reflection occurs, rather than modifying the entire cover structure. This localized addition minimizes the increase in device complexity while effectively addressing the light reflection problem at the bonding interface.
Solution Approach 2:
The patent creates a composite structure by combining the cover material, adhesive, and reflective prevention structure (film or groove). This composite approach allows each layer to perform its specific function: the cover provides sealing and protection, the adhesive provides bonding, and the reflective prevention structure manages light reflection, achieving overall optimization with minimal complexity increase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves light emission efficiency by reducing reflection and maintaining the quality of the light emitting element, while facilitating uniform fluorescent substance film formation and electrical connections, resulting in enhanced transmittance and reduced adhesive-related issues.
Implementation Method 1
reflection on a cover for covering the light emitting element is suppressed
Implementation Method 2
an incident angle with respect to the cover 17 of light emission from the light emitting element 12 increases
Implementation Method 3
when a fluorescent substance film is formed on the cover, uniformity of light emission in the case of obtaining a mixed color of light emission of a fluorescent substance and a light emitting element improves
Data Source
AI summary
A semiconductor device made by mounting a light emitting element on a substrate, where an optically-transparent cover with a flat plate shape is installed on the light emitting element and a groove part for suppressing reflection of light emission of the light emitting element is formed in the cover.