Encapsulating Cover Mounting With Setback Seating and Thick Adhesive Beads

Solution Overview

Problem

Existing electronic package designs are constrained by the limited thickness of adhesive beads (BLT) for precise vertical positioning, limiting the thickness and precision of encapsulating covers, especially when complex optical systems are involved.

Innovation Solution

The encapsulating cover is mounted on the carrier substrate using adhesive beads placed elsewhere than the seating surface, with seating surfaces located set back from the exterior borders, allowing for a thicker adhesive bead without compromising vertical positioning precision, and incorporating optical systems that modify incident light properties based on the distance from the chip surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the adhesive bead thickness is increased to provide better mechanical bonding, then the bonding strength is improved, but the vertical positioning precision of the cover deteriorates

Engineering Contradiction:

Improvebonding strengthVSAvoidvertical positioning precision

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The mounting interface is segmented into two distinct functional zones: a seating surface area for precise vertical positioning and an adhesive bead area for mechanical bonding. The seating surface comprises a front surface that protrudes from the mounting front face, providing a defined contact plane, while the adhesive bead is placed on the rear face of the cover at a location spaced from the seating surface, allowing each zone to optimize its specific function without interference from the other.

Inventive Principle:

Principle #1Segmentation

2Manufacturing precision

If the adhesive bead thickness is limited to maintain vertical positioning precision, then the positioning precision is improved, but the bonding strength and mechanical stability deteriorate

Engineering Contradiction:

Improvevertical positioning precisionVSAvoidbonding strength

Core Design Contradiction:

Manufacturing precisionVSStrength

Solution Approach 1:

The mounting interface is segmented into two distinct functional zones: a seating surface area for precise vertical positioning and an adhesive bead area for mechanical bonding. The seating surface comprises a front surface that protrudes from the mounting front face, providing a defined contact plane, while the adhesive bead is placed on the rear face of the cover at a location spaced from the seating surface, allowing each zone to optimize its specific function without interference from the other.

Inventive Principle:

Principle #1Segmentation

3Stability of the object's composition

If the seating surface is located at the exterior border to maximize contact area, then the mechanical stability is improved, but the adhesive bead space is reduced

Engineering Contradiction:

Improvemechanical stabilityVSAvoidadhesive bead space

Core Design Contradiction:

Stability of the object's compositionVSVolume of moving object

Solution Approach 1:

The mounting interface is segmented into two distinct functional zones: a seating surface area for precise vertical positioning and an adhesive bead area for mechanical bonding. The seating surface comprises a front surface that protrudes from the mounting front face, providing a defined contact plane, while the adhesive bead is placed on the rear face of the cover at a location spaced from the seating surface, allowing each zone to optimize its specific function without interference from the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The adhesive bead is positioned in a different spatial dimension relative to the seating surface. Instead of placing the adhesive bead in the same plane as the seating surface at the exterior border, it is located on the rear face of the cover at a position spaced from the seating surface, utilizing the depth dimension to accommodate both the seating surface for stability and the adhesive bead for bonding without spatial conflict.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables higher precision and complexity in optical systems, maintaining precise vertical alignment and accommodating thicker adhesive beads, enhancing performance without constraining thickness limitations.

Implementation Method 1

at least one adhesive bead located elsewhere than the seating surface in order to securely fasten said cover and said carrier substrate

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS12557424B2Electronic device comprising a carrier substrate and an encapsulating cover mounted on the carrier substrate, and corresponding mounting process

Publication Date: 2026.02.17 STMICROELECTRONICS (GRENOBLES 2) SAS

AI summary

A carrier substrate is configured to carry at least one electronic chip and includes a mounting front face. An encapsulating cover is mounted on the front face of the carrier substrate through a mounting. This mounting includes at least one seating surface through which the cover and the carrier substrate make contact. At least one adhesive bead is located elsewhere than the seating surface in order to securely fasten the encapsulation cover and the carrier substrate.