Electronic Device Cover With Nested Hinge In Composite Sheet
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Solution Overview
Problem
Existing electronic device covers with collapsible structures struggle to maintain slimness while allowing for adjustable mounting angles.
Innovation Solution
A cover design featuring a first plate attachable to an electronic device, a second plate overlapping the first plate, and a third plate connected to the second plate via a hinge, where at least one of the second or third plates includes a composite material sheet, and the hinge is partially disposed within this composite material sheet.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a collapsible structure is included in the cover to allow adjustment of mounting angles, then the adaptability of the cover is improved, but the thickness of the cover increases
Solution Approach 1:
The hinge structure is nested within the composite material sheet, with the hinge components embedded inside the thickness of the sheet rather than adding external protrusions. This allows the collapsible structure to be integrated into the existing cover thickness, maintaining slimness while enabling angle adjustment functionality.
Solution Approach 2:
The cover utilizes composite material sheets that integrate multiple functions (structural support, hinge mechanism, and aesthetic finishing) into a single layered component. The composite structure allows the hinge to be embedded within the material itself, reducing overall thickness while maintaining the collapsible feature.
2Device complexity
If the hinge is embedded in the composite material sheet, then the manufacturing complexity is reduced, but the precision of hinge positioning becomes more difficult to control
Solution Approach 1:
The hinge components are pre-positioned and embedded within the composite material sheet during the manufacturing process, rather than being assembled separately. This preliminary integration ensures consistent positioning accuracy while simplifying the overall manufacturing process by reducing the number of assembly steps.
Solution Approach 2:
The manufacturing process utilizes controlled parameter changes (such as temperature, pressure, or material state) during the embedding of hinge components into the composite material sheet. This allows precise positioning of the hinge while maintaining the simplicity of the manufacturing process through controlled material transformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a slim electronic device cover that simplifies the manufacturing process while allowing for adjustable mounting angles, contributing to a more compact and versatile design.
Implementation Method 1
a third plate connected to the second plate by a hinge and configured such that an angle defined by the third plate and the first plate is changed by a rotation of the third plate relative to the second plate
Implementation Method 2
a plurality of magnetic elements at least partially disposed in a composite material sheet of the first plate, wherein the plurality of magnetic elements applies an attractive force between the first plate and the electronic device
Data Source
AI summary
According to an embodiment of the present invention, an electronic device cover includes: a first plate that can be attached/detached to/from one surface of the electronic device; a second plate overlappingly coupled to the first plate; and a third plate which is connected to the second plate by a hinge and of which the angle formed with the first plate changes according to rotation with respect to the second plate, wherein the second plate and/or the third plate includes a composite material sheet, and at least a portion of the hinge can be positioned inside the composite material sheet. Other various embodiments are possible.