Cover Panel Via Holes for Uniform LED Voltage Distribution
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Solution Overview
Problem
Light emitting diode (LED) displays face challenges in achieving uniform luminance due to voltage drop issues, leading to non-uniform display quality and increased dead space from power wire occupation.
Innovation Solution
A cover panel design with a light blocking layer, cushion layer, and via holes connecting wires, which includes a heat dissipation layer and pads for power voltage distribution, reduces dead space and prevents voltage drops by uniformly supplying power to pixels through the substrate's rear surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power wires are used to supply voltage to pixels, then power distribution is achieved, but voltage drop occurs leading to non-uniform luminance
Solution Approach 1:
The patent transitions from planar power distribution to three-dimensional vertical distribution by routing power wires through the substrate thickness via via holes. This dimensional change allows power to reach pixels from the rear surface, eliminating the voltage drop issue that occurs in traditional planar wiring where voltage decreases with distance from the power source.
Solution Approach 2:
Instead of supplying power from the front surface where pixels are located, the patent inverts the approach by supplying power from the rear surface of the substrate. This inversion allows all pixels to receive power equidistantly from the power source, ensuring uniform voltage distribution and uniform luminance across the display.
2Reliability
If power wires are extended across the substrate, then power distribution is improved, but dead space increases
Solution Approach 1:
The patent moves power wires from the two-dimensional plane of the substrate surface into the third dimension by routing them through via holes perpendicular to the substrate. This allows power distribution without occupying additional lateral area, thus eliminating dead space while maintaining effective power delivery to all pixels.
3Ease of operation
If via holes are used to connect wires through the substrate, then vertical connection is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the substrate into multiple layers with via holes forming vertical channels through these layers. This segmentation allows for standardized manufacturing processes where via holes can be formed, filled, and planarized in a systematic manner, making the complex three-dimensional interconnection manageable through repeated application of standard fabrication steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances display quality by ensuring uniform voltage distribution across the display area, reducing heat concentration and dead space, and improving the overall display uniformity and reliability.
Implementation Method 1
the cover panel may further include a heat dissipation layer between the cushion layer and the wire
Implementation Method 2
a light blocking layer
Data Source
AI summary
A cover panel includes: a light blocking layer; a cushion layer overlapping with the light blocking layer; a wire overlapping with the cushion layer; and a via hole connected to the wire, and penetrating the light blocking layer and the cushion layer.