Cover Plate Bonding Layout to Prevent Seal Overflow in Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The prior manufacturing process of electronic devices faces issues with bonding materials overflowing or squeezing out of the bonding position, leading to functional defects and insufficient vacuum degrees, as well as material waste due to abnormal packaging.
Innovation Solution
A manufacturing method involving a circuit substrate with a first bonding member surrounding electronic units, covered by a cover plate with a second bonding member, where a bonding material is applied such that it does not overlap the second bonding member, and is melted to flow between the first and second bonding members, forming a sealed space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If bonding material is applied in the prior manufacturing process, then the cover plate and circuit substrate can be assembled, but the bonding material overflows or squeezes out of the bonding position
Solution Approach 1:
The bonding material is segmented into two distinct portions: a first portion disposed between the first bonding member and second bonding member, and a second portion disposed on the first bonding member. This segmentation allows the bonding material to be strategically positioned in different locations with different thicknesses, preventing overflow while ensuring adequate bonding.
Solution Approach 2:
The bonding material exhibits local quality variations through its two portions with different thicknesses. The first portion has a smaller thickness to prevent overflow into the sealed space, while the second portion has a larger thickness to ensure sufficient bonding strength. This local differentiation resolves the contradiction between assembly ease and positioning precision.
2Ease of manufacture
If bonding material overflows into the sealed space, then assembly can be completed, but the function of the electronic unit is affected and vacuum degree is insufficient
Solution Approach 1:
By segmenting the bonding material into two portions with controlled thicknesses, the invention prevents overflow into the sealed space while maintaining assembly feasibility. The first portion's smaller thickness specifically addresses the overflow problem, protecting the electronic unit's function and vacuum integrity.
Solution Approach 2:
The bonding material is pre-configured with controlled thickness distribution before assembly occurs. The first portion is deliberately designed with smaller thickness to preemptively prevent overflow into the sealed space, thereby protecting the electronic unit's functionality and vacuum degree before any harmful effect can occur.
3Strength
If bonding material is applied excessively, then bonding strength can be ensured, but material waste occurs due to abnormal packaging
Solution Approach 1:
The bonding material is applied with local quality differentiation: the second portion on the first bonding member has a larger thickness to ensure bonding strength, while the first portion between the bonding members has a smaller thickness to minimize material usage and prevent overflow. This localized thickness variation optimizes both strength and material efficiency.
Solution Approach 2:
The invention applies bonding material partially in two different quantities: a larger amount in the second portion where strength is needed, and a smaller amount in the first portion where overflow must be prevented. This partial action approach ensures adequate bonding strength while minimizing material waste and abnormal packaging.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces material overflow, maintains functional integrity, improves vacuum consistency, and minimizes waste by preventing interference with electronic unit operations and enhancing yield.
Implementation Method 1
melting the bonding material to allow part of the bonding material to flow in between the first bonding member and the second bonding member
Data Source
AI summary
A manufacturing method of electronic device includes: (a) providing a circuit substrate including: a substrate; a plurality of electronic units disposed on the substrate; and a first bonding member disposed on the substrate, wherein the first bonding member surrounds the electronic units; (b) respectively disposing a plurality of cover plates on at least part of the electronic units, and disposing a bonding material on the first bonding member, wherein one of the cover plates includes a second bonding member and, in the top view direction of the circuit substrate, the second bonding member overlaps at least part of the first bonding member, and the bonding material does not overlap the second bonding member; and (c) melting the bonding material to allow part of the bonding material to flow in between the first bonding member and the second bonding member.