Integrated Cover Separation Heating for Electronic Device Repair
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Solution Overview
Problem
The process of separating the front or rear cover of high-integration electronic devices, such as mobile communication terminals, is complex, time-consuming, and prone to damage due to heat loss and excessive overheating, with existing methods requiring multiple devices and processes that can lead to errors and abrasion of adsorption members.
Innovation Solution
An integral separable electronic device with a heating unit, a fixing unit, an adsorption unit, and a driving unit that allows for simultaneous heating and separation of the cover, minimizing the need for external devices and reducing the risk of damage by controlling the heating and separation process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple separate devices and processes are used for heating and separation, then the separation function can be achieved, but the process becomes complex and time-consuming
Solution Approach 1:
The patent combines the heating device and separation device into a single integrated separable device. The heating unit includes heating plates that can heat the electronic device, while the separation unit includes adsorption members that can adsorb the cover. These functions are merged into one device structure, eliminating the need for multiple separate devices and processes, thereby simplifying the overall process while maintaining both heating and separation capabilities.
2Reliability
If multiple separate devices and processes are used for heating and separation, then the separation function can be achieved, but the process becomes time-consuming
Solution Approach 1:
The integrated separable device allows for continuous operation where heating and separation can be performed in sequence without removing the device from the system. The heating plates continuously heat the electronic device, and the adsorption members continuously adsorb the cover, eliminating idle time between processes and improving overall productivity.
3Ease of operation
If the electronic device is exposed to external atmosphere during transfer, then the separation process can proceed, but heat loss occurs
Solution Approach 1:
By integrating the heating and separation functions into a single device, the electronic device remains within the heated environment throughout the separation process. The heating plates continue to provide heat while the adsorption members perform separation, eliminating the need to expose the device to external atmosphere and preventing heat loss.
4Ease of operation
If manual recognition of heating status is performed, then the process can be controlled, but delays and errors may occur
Solution Approach 1:
The integrated separable device performs heating and separation automatically without requiring manual intervention to recognize heating status. The heating plates automatically heat the device, and the adsorption members automatically adsorb the cover based on the heating process, eliminating delays and errors associated with manual recognition and control.
5Ease of operation
If adsorption members are used for separation, then the cover can be adsorbed, but the members are easily abraded and adsorptive power degrades
Solution Approach 1:
The adsorption members are integrated into the separable device structure, working in conjunction with the heating plates. This integration provides structural support and protection to the adsorption members, reducing their exposure to abrasive forces and extending their service life while maintaining adsorption functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the repair process, improves efficiency and accuracy, reduces damage to the electronic device, and lowers repair costs by integrating the heating and separation functions into a single device, minimizing heat loss and the influence of the worker's skill level.
Implementation Method 1
heating an external electronic device placed on at least one surface of the lower heating unit
Implementation Method 2
heating an external electronic device placed on at least one surface of the lower heating unit
Implementation Method 3
an adsorption unit, a part of which is inserted into at least one recess formed in the upper heating unit, to adsorb at least a region of the external electronic device
Data Source
AI summary
According to various embodiments of the present invention, an electronic device comprises: a heating unit, which includes a lower heating unit and an upper heating unit rotatably coupled to the lower heating unit, and heats an external electronic device mounted on at least one surface of the lower heating unit; a fixing unit, which is disposed to be adjacent to the lower heating unit, and has at least one part formed to be movable in the longitudinal direction of the lower heating unit, thereby fixing the external electronic device; a adsorption unit having one part, which is inserted into at least one recess formed on the upper heating unit, and adsorbing at least a region of the external electronic device; and a driving unit, which is disposed at one side or a surrounding part of the heating unit, can move in the direction perpendicular to the moving direction of the fixing unit, and rotates the upper heating unit by pressurizing the same.