Cover Tape Heat Sealant Layer for Static Control
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Solution Overview
Problem
Conventional cover tapes for electronic component packaging face issues with static electricity-induced adhesion and breakage of components, particularly during peeling, due to friction and charging, which complicates the semiconductor and electronic component assembly processes, and existing solutions either compromise on transparency, sealing properties, or effectiveness.
Innovation Solution
A cover tape design featuring a heat sealant layer composed of polyolefin resin and polyether-polyolefin copolymer, with a weight ratio of 10-70% and a melt flow rate of 10-35 g/10 min, combined with an intermediate layer containing an antistatic agent like propylene carbonate and a cationic surfactant, to manage static charging and maintain transparency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional cover tape is used for packaging electronic components, then packaging and transport are enabled, but static electricity is generated during peeling due to friction, causing adhesion and breakage of components
Solution Approach 1:
A release layer is introduced as an intermediary between the carrier tape and cover tape. This release layer prevents direct contact and friction between the cover tape and electronic components during peeling, thereby eliminating static electricity generation while maintaining easy peeling operation
Solution Approach 2:
The cover tape is constructed as a composite structure with multiple functional layers including a transparent resin layer, release layer, and heat sealant layer. Each layer performs a specific function: the transparent resin layer maintains visibility, the release layer prevents static charging, and the heat sealant layer ensures proper sealing, collectively resolving the contradiction between peeling ease and static electricity prevention
2Reliability
If inorganic material is added to improve conductive properties, then electrostatic discharge protection is enhanced, but transparency is impaired, hindering visual inspection
Solution Approach 1:
Instead of using permanent inorganic conductive materials that compromise transparency, the invention employs an organic-based heat sealant layer with controlled electrostatic properties. This disposable-like approach prioritizes visual inspection clarity while providing sufficient electrostatic discharge protection through the organic material's inherent properties
Solution Approach 2:
The invention changes the material parameter from inorganic to organic-based conductive materials. The heat sealant layer uses organic compounds with controlled electrostatic properties that maintain transparency while providing adequate electrostatic discharge protection, thus resolving the contradiction between reliability and illumination intensity
3Reliability
If conductive polymer layer is laminated onto the cover tape to prevent static electricity, then electrostatic protection is improved, but the conductive layer peels off during heat sealing
Solution Approach 1:
Instead of laminating a separate conductive polymer layer that may peel off, the invention merges the electrostatic protection function directly into the heat sealant layer. The heat sealant layer itself possesses controlled electrostatic properties, eliminating the need for a separate conductive layer and thus preventing adhesion issues while maintaining electrostatic protection
Solution Approach 2:
The heat sealant layer is designed as a composite material that integrates both sealing and electrostatic protection functions. By combining these functions in a single integrated layer rather than separate laminated layers, the invention ensures stable composition and prevents peeling during heat sealing while maintaining electrostatic protection
4Reliability
If surfactant is incorporated into the intermediate layer to prevent electrostatic induction, then electrostatic protection is improved, but bleeding and deterioration of film properties occur
Solution Approach 1:
Instead of using surfactants that may bleed and deteriorate film properties over time, the invention employs an organic-based heat sealant layer with inherently stable electrostatic properties. This approach provides durable electrostatic protection without the bleeding and deterioration issues associated with surfactant-based solutions
Solution Approach 2:
The invention changes the approach from using surfactant-based electrostatic protection to organic material-based protection. The heat sealant layer uses organic compounds with controlled electrostatic properties that maintain film physical stability while providing effective electrostatic protection, resolving the contradiction between reliability and composition stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses static charging during peeling, ensuring excellent transparency and antistatic properties, with a peeling charge of 300 V or less, preventing component adhesion and breakage, while maintaining mechanical strength and sealing integrity.
Implementation Method 1
Static charging between cover tape and components due to friction during transport, and generation of static electricity during peeling of cover tape have resulted in problems
Implementation Method 2
cover tape that can be heat sealed to the carrier tape
Data Source
AI summary
According to the present invention, a cover tape for electronic component packaging is provided which has suitable transparency, and which enables suppression of the charge that occurs during peeling from carrier tape. The cover tape for electronic component packaging of the present invention is provided with a heat sealant layer on top of the base layer, and the aforementioned heat sealant layer contains polyolefin resin and polyether-polyolefin copolymer. The weight ratio of the polyether-polyolefin copolymer in the aforementioned heat sealant layer is 10 weight % or more and 70 weight % or less.