Covered Microchamber Structures with Embossed Registration

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Solution Overview

Problem

Existing microchamber structures often lack effective solutions for creating covered microchambers suitable for microfluidic, microelectronic, and microoptical devices, with challenges in registration and sealing, especially at small sizes and complex geometries.

Innovation Solution

A microchamber structure comprising a base layer and a lid layer with embossed depressions and projections, allowing for precise alignment and sealing, with options for adhesive or dry photoimageable polymer film attachment, enabling the formation of covered microchambers with varying dimensions and geometries.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional microchamber structures are used, then manufacturing is simpler, but registration precision and sealing effectiveness deteriorate at small sizes

Engineering Contradiction:

Improveregistration precisionVSAvoidstructure complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The lid layer is segmented into multiple discrete protrusions that correspond to recesses in the base layer, creating modular registration features. This segmentation allows for precise alignment without requiring complex overall structures, as each protrusion-recess pair independently contributes to registration accuracy.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The registration features (protrusions and recesses) are pre-formed during the embossing process before final assembly. This preliminary action ensures that alignment features are already in place when layers are joined, eliminating the need for post-assembly alignment adjustments and improving registration precision.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If adhesive is used to attach layers, then sealing is improved, but material requirements and process complexity increase

Engineering Contradiction:

Improvesealing effectivenessVSAvoidmanufacturing simplicity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

Adhesive is used as an intermediary substance placed in recesses to bond the lid layer to the base layer. This intermediary approach provides reliable sealing while keeping the overall structure simple, as the adhesive is contained within pre-formed recesses rather than requiring complex bonding mechanisms.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

Adhesive is applied locally within specific recesses rather than across the entire surface. This localized application provides sealing where needed while minimizing material usage and simplifying the manufacturing process by eliminating the need for complete surface coating.

Inventive Principle:

Principle #3Local quality

3Ease of manufacture

If dry photoimageable polymer film is used instead of adhesive, then manufacturing is simplified, but sealing reliability may be compromised

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidsealing effectiveness

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The mechanical embossing process replaces the chemical adhesive bonding process. By using protrusions and recesses that mechanically interlock during embossing, the patent achieves layer attachment without requiring adhesive materials, simplifying manufacturing while maintaining structural integrity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The attachment and sealing functions are merged into the embossing process itself. The same embossing operation that creates the microchamber geometry also forms the registration features and creates mechanical attachment between layers, eliminating the need for separate adhesive application steps.

Inventive Principle:

Principle #5Merging (Combining)

4Manufacturing precision

If embossing is used to form microchambers, then manufacturing precision is improved, but equipment requirements increase

Engineering Contradiction:

Improvechamber geometry precisionVSAvoidequipment requirements

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The embossing tool serves multiple functions: it forms the microchamber geometry, creates registration features (protrusions and recesses), and establishes mechanical attachment between layers. This multi-functionality reduces equipment requirements compared to processes that would need separate tools for each function.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

All geometric features and registration elements are pre-formed during the embossing process before assembly. This preliminary action eliminates the need for subsequent machining or alignment operations, reducing equipment requirements while maintaining high manufacturing precision.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS7514045B2Covered microchamber structures

Publication Date: 2009.04.07 AVERY DENNISON CORP

AI summary

A microchamber structure (100) comprising a base layer (120), a lid layer (130), and at least one microchamber (140) having a cross-sectional shape with a depth (d) of less than 1000 microns and a width (w) of less than 1000 microns. The base layer (120) includes a depression (122) and the lid layer (104) includes a projection (132) positioned within the depression (122) to together define the cross-sectional shape of the microchamber (140).