CPO Optical Module Thermal Management With Distributed Heat Dissipation
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Solution Overview
Problem
CPO technology faces challenges in thermal management and power consumption due to heat accumulation in optical modules, which compromises the integration of active components for high-speed optical communication.
Innovation Solution
Incorporating a plurality of heat dissipation components between the substrate and housing in the optical module to distribute thermal loads, preventing heat accumulation and ensuring effective thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If CPO technology integrates electronic integrated circuit and photonic integrated circuit on the same carrier, then component integration density and transmission rate are improved, but thermal management becomes more difficult due to heat accumulation
Solution Approach 1:
The patent divides the heat dissipation function into multiple independent heat dissipation components distributed across the substrate, rather than using a single centralized heat dissipation system. Each heat dissipation component is positioned to serve specific optical communication assemblies, enabling localized thermal management that prevents heat accumulation while maintaining high component integration density
Solution Approach 2:
The patent implements localized heat dissipation by positioning heat dissipation components specifically beneath or adjacent to heat-generating optical communication assemblies on the substrate. This local化的 thermal management approach allows high transmission rates at specific locations without causing overall system overheating, as each component receives targeted thermal management
2Productivity
If multiple optical communication assemblies are disposed on the substrate, then component integration density is improved, but thermal management complexity increases
Solution Approach 1:
The patent segments the thermal management system into multiple independent heat dissipation components, each responsible for specific optical communication assemblies. This segmentation allows the system to handle multiple components simultaneously without requiring a complex centralized thermal management system, as each unit operates independently to dissipate heat from its associated assembly
Solution Approach 2:
The substrate serves as a thermal intermediary that conducts heat from multiple optical communication assemblies to the heat dissipation components. This intermediary approach simplifies thermal management by using the existing substrate structure to distribute and manage heat, rather than requiring complex active cooling systems for each component
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages thermal loads, allowing for higher component integration without excessive thermal consumption, supporting higher transmission rates like 1.6 Tbps, 3.2 Tbps, or 6.4 Tbps in optical communication systems.
Implementation Method 1
a plurality of heat dissipation components... located between the mounting surface of the substrate and the housing... corresponding to the plurality of optical communication assemblies
Data Source
AI summary
The present disclosure provides an optical module with CPO configuration which includes a housing, a substrate, a plurality of optical communication assemblies, and a plurality of heat dissipation components. The substrate is disposed in the housing. The plurality of optical communication assemblies are disposed on a mounting surface of the substrate. The heat dissipation components are spaced apart from each other and located between the mounting surface of the substrate and the housing, and the heat dissipation components are disposed to be corresponding to the plurality of optical communication assemblies, respectively.