CPP-GMR Device Nitrogen Interface Layer for Thermal Stability

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Solution Overview

Problem

Magneto-resistive effect devices, particularly CPP-GMR devices, face issues with resistance fluctuations and deteriorations due to heat and stress, leading to noise and performance degradation, and struggle to achieve high MR ratios and low resistance simultaneously.

Innovation Solution

Incorporating a nitrogen element-containing interface protective layer between the semiconductor oxide layer and the insulating layer in the CPP-GMR device structure, which forms a nitride with high covalent bonding capability, inhibiting oxygen migration and stabilizing device characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the tunnel barrier layer thickness is reduced to lower resistance, then resistance decreases, but pinholes occur more frequently and device reliability deteriorates

Engineering Contradiction:
Improvedevice reliabilityVSAvoidresistance
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent employs a composite multilayer structure comprising a semiconductor oxide layer (such as ZnO, In2O3, or SnO2) integrated with magnetic layers to form the tunnel barrier. This composite approach allows achieving low resistance without pinholes by utilizing the unique properties of semiconductor oxides, which provide both electrical conductivity and structural integrity, thus resolving the contradiction between low resistance and device reliability

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the material parameter from conventional insulating tunnel barriers to semiconductor oxide materials with specific band gap and conductivity characteristics. By controlling the semiconductor oxide layer thickness and composition, the patent achieves optimal resistance values while maintaining structural integrity and preventing pinhole formation, thereby resolving the resistance-reliability contradiction

Inventive Principle:
Principle #35Parameter changes

2Temperature

If the semiconductor oxide layer is exposed to heat and stress, then thermal energy increases, but resistance fluctuations and device deterioration occur

Engineering Contradiction:
Improvethermal stabilityVSAvoiddevice characteristics stability
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent introduces an interface protective layer containing nitrogen elements (such as SiN, SiON, AlON, BN, or BON) as an intermediary between the semiconductor oxide layer and the insulating layer. This protective layer acts as a buffer that prevents direct exposure of the semiconductor oxide to thermal stress and oxygen migration, thereby maintaining device characteristics stability under heat exposure and resolving the contradiction between temperature increase and reliability maintenance

Inventive Principle:
Principle #24Intermediary (Mediator)

3Measurement precision

If high MR ratio is achieved through optimized layer structure, then detection sensitivity improves, but device resistance increases

Engineering Contradiction:
Improvemagnetic field detection sensitivityVSAvoidresistance
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The patent utilizes a composite structure where semiconductor oxide layers are integrated with ferromagnetic layers (containing Co, Fe, Ni, or their alloys) and nonmagnetic metal layers (such as Cu, Ag, Al, or their alloys). This composite multilayer configuration enables simultaneous achievement of high MR ratio for sensitive magnetic field detection and low resistance for good high-frequency response, resolving the contradiction between measurement precision and harmful resistance effects

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the thermal stability and reduces resistance fluctuations, maintaining device performance and MR ratios while minimizing noise and resistance changes, even under stress and heat exposure.

Implementation Method 1

forms a nitride with high covalent bonding capability

Methodology Applied
Scientific EffectChemical Bonding: Chemical Bonding

Implementation Method 2

inhibiting oxygen migration

Methodology Applied
Scientific EffectDiffusion Barrier: Diffusion Barrier

Implementation Method 3

a giant magneto-resistive effect device (CPP-GMR device) having the CPP (current perpendicular to plane) structure

Methodology Applied
Scientific EffectGiant Magneto-Resistive Effect: Magnetoresistance

Data Source

PatentUS8472149B2CPP type magneto-resistive effect device and magnetic disk system
Publication Date: 2013.06.25 TDK CORP
  • US8472149B2 patent drawing
  • US8472149B2 patent drawing
  • US8472149B2 patent drawing

AI summary

The invention provides a giant magneto-resistive effect device of the CPP (current perpendicular to plane) structure (CPP-GMR device) comprising a spacer layer, and a first ferromagnetic layer and a second ferromagnetic layer stacked together with said spacer layer sandwiched between them, with a sense current passed in the stacking direction, wherein the first ferromagnetic layer and the second ferromagnetic layer function such that the angle made between the directions of magnetizations of both layers change relatively depending on an external magnetic field, said spacer layer contains a semiconductor oxide layer, and a nitrogen element-interface protective layer is provided at a position where the semiconductor oxide layer forming the whole or a part of said spacer layer contacts an insulating layer. Thus, there is a nitride of high covalent bonding capability formed at the surface of junction between the semiconductor oxide layer and the interface protective layer, so that the migration of oxygen from the semiconductor oxide layer to the insulating layer is inhibited; even when the device undergoes heat and stress in the process, fluctuations and deteriorations of device characteristics are held back.