Direct-Bonded CPU Cold Plate Assembly With Clean Coolant Channels

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Solution Overview

Problem

Existing cooling systems for microelectronic devices suffer from reduced efficiency due to thermal resistance and contamination at thermal interfaces, which are exacerbated by debris and contaminants, and are not adaptable for batch processes, leading to increased manufacturing costs and time.

Innovation Solution

The method involves manufacturing an integrated cooling assembly with a cold plate directly bonded to a die, where coolant channels are protected during assembly to prevent debris and contaminants, and the assembly is adaptable to batch processes, reducing thermal resistance and maintaining cooling efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If traditional cooling systems use thermal interface materials and multiple components between chip and heat dissipation device, then assembly is easier to manufacture, but thermal resistance increases and cooling efficiency decreases

Engineering Contradiction:

Improveassembly easeVSAvoidcooling efficiency

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The cold plate is directly bonded to the backside of the semiconductor device, merging the heat dissipation device with the device package into a single integrated structure. This eliminates thermal interface materials and intermediate components, reducing cumulative thermal resistance while maintaining manufacturability through direct bonding processes.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The invention extracts and removes thermal interface materials (TIMs) and intermediate components from the heat transfer path. By eliminating these components, the patent reduces the number of thermal interfaces and their associated thermal resistance, achieving superior cooling efficiency.

Inventive Principle:

Principle #2Taking out (Extraction)

2Ease of manufacture

If coolant channels are exposed during manufacturing, then assembly process is simpler, but debris and contaminants enter channels and reduce cooling efficiency

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidchannel cleanliness

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The coolant channels are sealed and protected during the manufacturing process before final assembly. Caps or plugs are placed in the channel openings prior to bonding the cold plate to the semiconductor device, preventing debris and contaminants from entering the channels. The channels are then opened after bonding is complete, ensuring cleanliness while maintaining manufacturing simplicity.

Inventive Principle:

Principle #10Preliminary action

3Ease of manufacture

If thermal interface materials are used to facilitate heat transfer, then assembly is easier, but thermal resistance at interfaces increases

Engineering Contradiction:

Improveassembly easeVSAvoidheat transfer efficiency

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

4Adaptability or versatility

If manufacturing process is not adaptable to batch processes, then flexibility is higher, but manufacturing cost and time increase

Engineering Contradiction:

Improveprocess flexibilityVSAvoidmanufacturing efficiency

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The manufacturing method is designed to be universal and adaptable to batch processing. The cold plate bonding process can simultaneously bond multiple semiconductor devices to a single cold plate, and the channel sealing approach can be applied across entire wafers or batches of devices, enabling high-volume production while maintaining process flexibility.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach mitigates debris and contaminants, reduces thermal resistance, and enhances cooling efficiency while being suitable for batch manufacturing, thereby improving the performance and reliability of microelectronic devices.

Implementation Method 1

a cold plate attached (e.g., directly bonded) to a first die... directly bonding the first portion of the cold plate to a backside of the first die

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

coolant channels of the cold plate... defining a channel volume... opening the inlet portion and the outlet portion of the channel volume

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20250309045A1Liquid cooling to CPU/mcm bond and package process flow

Publication Date: 2025.10.02 ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC

AI summary

In some implementations, a method of manufacturing a cooling apparatus includes forming an integrated cooling assembly by attaching a cold plate to a backside of a first die. A first side of the cold plate is spaced apart from the first die to define a channel volume having an inlet portion and an outlet portion that are closed at a second side of the cold plate opposite to the first side. The method further includes attaching the integrated cooling assembly to an interposer, wherein a plurality of second dies is disposed on the interposer, and subsequent to attaching the integrated cooling assembly to the interposer, opening the inlet portion and the outlet portion of the channel volume.