Single-Phase Immersion Cooling With CPU-Forced Cooling Circuit
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional single phase liquid immersion cooling systems fail to effectively cool the main heat-generating components, such as CPUs, leading to poor overall cooling performance when multiple electronic devices operate simultaneously.
Innovation Solution
A single phase liquid immersion cooling system with a forced cooling circuit that includes an active cooling circulating unit, utilizing a motor pump to force low-temperature dielectric fluid through a heat exchanger, manifold, and radiators specifically focused on cooling the main heat-generating components like CPUs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional single phase liquid immersion cooling system is used, then electronic devices can be cooled, but the main heat-generating components (CPU) cannot be effectively cooled, resulting in poor overall cooling performance
Solution Approach 1:
The patent introduces a forced cooling circuit that selectively directs dielectric fluid to radiators mounted on CPU heat sinks, providing localized enhanced cooling to the main heat-generating components while other components rely on natural convection. This local quality differentiation resolves the contradiction by concentrating cooling resources where they are most needed.
Solution Approach 2:
The cooling system is segmented into two pathways: a forced cooling circuit for CPU-specific cooling and a natural convection pathway for other components. The forced cooling circuit includes dedicated radiators and fluid circulation paths that separately serve the CPU, allowing independent optimization of cooling performance for different components.
2Productivity
If motor pump is used to force dielectric fluid circulation, then cooling coverage is improved, but power consumption increases
Solution Approach 1:
The patent applies forced cooling only partially - specifically to the CPU through dedicated radiators and a selective forced cooling circuit - rather than forcing circulation throughout the entire immersion cooling system. This partial application of forced cooling achieves improved CPU cooling efficiency while minimizing the power consumption penalty of pump operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves improved cooling performance by focusing on CPUs, reducing thermal resistance and enhancing heat dissipation capacity, with lower power consumption and environmental impact.
Implementation Method 1
the undesirable heat generated from the heat-generating electronic devices 230 is transferred into the dielectric fluid
Implementation Method 2
through a heat exchanger 300 and into a fluid inlet pipe 410, thereby sending the dielectric fluid cooled by the heat exchanger 300 back to the tank 210
Implementation Method 3
a motor pump 60 is commonly used to force the heated dielectric fluid out of the tank 210, sequentially into a fluid outlet pipe 420
Data Source
AI summary
Disclosed is a single phase liquid immersion cooling system with a forced cooling circuit for cooling heat-generating electronic devices, such as servers. The cooling system comprises an immersion cooling unit, a heat exchanger, and a dielectric fluid circulating unit. The immersion cooling unit includes a tank within which dielectric fluid and heat-generating electronic devices are maintained. The heat-generating electronic devices are provided with a radiator and submerged in the body of dielectric fluid. The dielectric fluid circulating unit includes a fluid outlet pipe interconnecting the heat exchanger with the tank, a motor pump disposed on the fluid outlet pipe, a manifold, a first fluid inlet pipe interconnecting the manifold with the heat exchanger, and a second fluid inlet pipe interconnecting the manifold with the radiator.