CPU Heating Module With Heat Spreader for PCB Layout Flexibility

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Solution Overview

Problem

Conventional film heaters mounted on motherboards or system chassis for CPU heating disrupt the layout and increase power consumption, making it difficult to maintain CPU functionality at low temperatures and affecting board design.

Innovation Solution

A heating module with a heat spreader positioned between the CPU and film heater, which conducts heat efficiently without directly contacting the motherboard or system chassis, using a thermal pad to transfer heat to the chassis, thereby maintaining CPU temperature without altering the board layout and reducing power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the film heater is mounted directly on the motherboard or PCB around the CPU, then the CPU can be maintained at temperatures higher than 0°C, but the board layout is impacted and no other components can be placed in the heater keep-out zones

Engineering Contradiction:

ImproveCPU temperatureVSAvoidboard layout area

Core Design Contradiction:

TemperatureVSArea of stationary object

Solution Approach 1:

The patent introduces a heat spreader as an intermediary component between the film heater and the CPU. The film heater is mounted on the heat spreader rather than directly on the motherboard, allowing heat to be conducted to the CPU through the heat spreader. This intermediary structure eliminates the need for heater keep-out zones on the motherboard, resolving the conflict between heating effectiveness and board layout flexibility.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Device complexity

If the film heater is installed on the inner surface area of the system chassis, then the heating mechanism is simplified, but most of the heat generated is lost to the outside environments resulting in higher heater power consumption

Engineering Contradiction:

Improveheating mechanism complexityVSAvoidheater power consumption

Core Design Contradiction:

Device complexityVSUse of energy by moving object

Solution Approach 1:

The heat spreader acts as a mediator that directs heat flow preferentially toward the CPU rather than allowing it to dissipate into the system chassis environment. By positioning the heat spreader in direct contact with the CPU and having the film heater mounted on its outer surface, the structure creates a thermal pathway that prioritizes heat transfer to the CPU, reducing heat loss to the surroundings and lowering power consumption.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The heat spreader has different thermal conductivity properties in different directions - it is designed to conduct heat efficiently toward the CPU while having lower thermal conductivity toward the system chassis environment. This local quality differentiation ensures that heat is directed where needed (to the CPU) rather than being lost uniformly in all directions, thereby reducing overall power consumption.

Inventive Principle:

Principle #3Local quality

3Volume of moving object

If the film heater is mounted directly on the PCB, then the heating structure is compact, but the heater occupies areas of the motherboard affecting the board layout

Engineering Contradiction:

Improveheating structure volumeVSAvoidboard layout adaptability

Core Design Contradiction:

Volume of moving objectVSAdaptability or versatility

Solution Approach 1:

The heat spreader serves as a mediator that decouples the film heater from the motherboard surface. Instead of the heater occupying space on the PCB (which would create keep-out zones), the heater is mounted on the heat spreader which is positioned between the heater and the motherboard. This allows the motherboard layout to remain flexible while maintaining a compact heating structure, as the heat spreader can be positioned in the vertical space above the CPU without restricting PCB component placement.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The heating module maintains CPU temperature above 0°C at low environmental temperatures while minimizing power usage, ensuring efficient heat distribution without impacting the motherboard layout.

Implementation Method 1

a heat spreader mounted between the CPU and the film heater. The heat spreader is configured to conduct the heat from the film heater to the CPU

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

using a thermal pad to transfer heat to the chassis

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250328175A1Heating module and computing system including the same

Publication Date: 2025.10.23 QUANTA COMPUTER INC

AI summary

A computing system is disclosed. The computing system includes a system chassis configured to perform as a heatsink; a printed circuit board (PCB) enclosed within the system chassis; a central processing unit (CPU) mounted on the PCB within the system chassis; a film heater enclosed within the system chassis, the film heater being configured to generate heat for maintaining the CPU within an operable temperature range; and a heat spreader mounted between the CPU and the film heater. The heat spreader is configured to conduct the heat from the film heater to the CPU without affecting the layout of the PCB.