Pluggable CPU Module With Vertical VR Bonding and Low-Loss Power
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Solution Overview
Problem
Vertical power arrangements in modern processors face challenges such as power loss and delay due to longer power delivery paths, and require complex reflow steps for component installation and replacement, which can cause board warpage and inefficiencies.
Innovation Solution
A self-contained module with a microprocessor package and voltage regulator, where the microprocessor is directly bonded to the voltage regulator, and a motherboard with apertures for easy installation and replacement, reducing the power delivery path and eliminating the need for reflow steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the voltage regulator is located on the same side of the board as the powered component, then the installation process is simpler, but the power delivery path becomes longer causing increased power loss and delay
Solution Approach 1:
The voltage regulator is moved from the same side of the board to the opposite side, utilizing the third dimension (vertical arrangement) to create a direct power delivery path through the board. This dimensional change allows the power to travel vertically through the board thickness rather than horizontally across the board surface, significantly shortening the power delivery path while maintaining simple installation procedures.
2Loss of energy
If the voltage regulator is bonded directly under the processor, then the power delivery path is shortened, but two separate reflow steps are required for installation
Solution Approach 1:
The processor package and voltage regulator are merged into a single integrated unit where the voltage regulator is directly bonded to the underside of the processor package. This combination allows both components to be installed simultaneously in a single reflow step, eliminating the need for separate reflow operations while maintaining the short power delivery path benefits.
3Loss of energy
If multiple pairs of voltage regulators and processors are installed on the same board, then the power delivery is improved, but board warpage occurs
Solution Approach 1:
The system is segmented into multiple independent processor-voltage regulator units that can be installed in a distributed manner across the board. Each unit is self-contained with its own voltage regulator directly bonded to the processor package, allowing for balanced thermal and mechanical distribution that reduces board warpage while maintaining efficient power delivery across multiple processing points.
4Reliability
If the voltage regulator and processor are installed using traditional methods, then the connection is stable, but replacement and reconfiguration require heating the entire board
Solution Approach 1:
The processor and voltage regulator are segmented into a separate removable unit that can be replaced independently from the main board. The voltage regulator is bonded to the underside of the processor package, creating a self-contained module that can be installed or replaced as a single unit without requiring access to or heating of the entire board, thus improving ease of repair while maintaining connection stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes power loss and delay, simplifies component installation and replacement, and reduces board warpage, allowing for independent replacement of modules and PCBAs, enhancing flexibility and reducing design and maintenance costs.
Implementation Method 1
The microprocessor package may be bonded or otherwise electrically connected directly to the voltage regulator, thereby minimizing the power delivery path
Implementation Method 2
conductive pillars electrically connecting the capacitor board to the power board
Data Source
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AI summary
A pluggable processor module includes a microprocessor package, a voltage regulator including a capacitor board, and contact pads that each include a first side in contact with the microprocessor package and a second side in contact with the capacitor board.