CPU Socket Terminal Module for Fine-Pitch Contact Alignment
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Solution Overview
Problem
Conventional CPU sockets using pin grid array (PGA) packaging technology are not suitable for high-integration chips due to inadequate spacing between contact points, leading to issues like solder skip, insertion failure, and complex replacement processes.
Innovation Solution
A socket connector device with a terminal module comprising rows of terminals with a fine-pitch structure, supported by a circuit module and protected by a cover plate, ensuring high strength, low power loss, and easy assembly, while maintaining terminal alignment and preventing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pin grid array (PGA) packaging technology is used with conventional CPU sockets, then pins can be directly inserted into small holes to complete installation, but the spacing between contact points is insufficient for high-integration chips, causing solder skip, no solder, and insertion failure
Solution Approach 1:
The patent changes the contact structure from pins to planar contact points with a specific geometric shape (rectangular or oval cross-section). This parameter change in contact geometry enables reduced spacing between contact points while maintaining adequate contact area, thus achieving fine-pitch compatibility without sacrificing soldering quality or insertion reliability
Solution Approach 2:
The patent inverts the conventional PGA approach by placing contact points on the socket side rather than pins on the CPU side. This LGA (Land Grid Array) inversion allows the socket to provide the contact structure, enabling finer pitch spacing that would be difficult to achieve with traditional pin-based CPU packaging
2Ease of operation
If pins are used in conventional CPU sockets, then connection can be established, but pins have no protection mechanism making insertion failure easy to occur
Solution Approach 1:
The patent incorporates a protective structure where the contact points are embedded in a substrate with a protective layer. This beforehand cushioning protects the contact points from damage during insertion, preventing insertion failure while maintaining ease of operation. The protective structure absorbs insertion forces before they reach the actual contact points
3Reliability
If BGA packaging technology is used with pins on CPU socket, then connection can be established, but replacement requires hot air gun or reflow soldering making the process complicated and difficult, and easy to cause damage to PCB
Solution Approach 1:
The patent segments the connection system into a removable CPU component and a fixed socket with contact points on the motherboard. This segmentation allows the CPU to be easily removed and replaced without affecting the motherboard's integrity, unlike BGA where the chip is permanently soldered. The socket design enables tool-free or simple tool-assisted replacement while maintaining connection stability
Solution Approach 2:
The patent introduces a socket as an intermediary component between the CPU and motherboard. This intermediary enables easy CPU replacement by providing a mechanical interface that doesn't require permanent soldering, thus simplifying repair processes while maintaining reliable electrical connections through the contact points
4Adaptability or versatility
If fine-pitch terminals are implemented in socket connector device, then compatibility with high-integration chips is improved, but terminal alignment and protection become more critical to prevent damage
Solution Approach 1:
The patent uses a nested structure where contact points are embedded within a substrate, which is then covered by a protective layer. This nesting protects the fine-pitch contact points from external forces while maintaining their precise spacing for high-integration chip compatibility. The multi-layer nested structure shields vulnerable terminals without compromising adaptability
Data Source
AI summary
A socket connector device for mating with a central processing unit having conductive portions is provided. The socket connector device includes a circuit module, a terminal module, and a cover plate. The terminal module is placed on the circuit module. The terminal module includes a terminal block. The terminal module includes a terminal block, multiple rows of terminals integrally formed with the terminal block, and a support housing protecting the terminal block. Each terminal includes a first contact end and a second contact end corresponding to each other. The second contact end protrudes from the support housing. Each first contact end electrically contacts one conductive portion, and each second contact end electrically contacts the circuit module. The cover plate is rotatably assembled on the terminal module, so that the conductive portions of the central processing unit electrically contact or do not contact the terminals of the terminal block.