Conductive Paste Mold for CPV Die Interconnect
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Solution Overview
Problem
Current CPV modules face challenges with ribbon/mesh type interconnects, such as poor shape control, labor-intensive manual soldering, and potential current crowding issues, which detract from their utility and electrical current carrying capability.
Innovation Solution
The use of a conductive paste as an alternative to wire bonds or braided ribbon/mesh connectors, where the paste is dispensed or printed between the photovoltaic receiver die and the substrate, facilitated by a mold body that defines a reservoir for controlled flow and contact, ensuring reliable electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ribbon/mesh type interconnects are used to facilitate electrical connection, then current carrying capability is improved, but shape control and ease of manufacture deteriorate due to poor shape control and requirement for specialized welding equipment
Solution Approach 1:
The patent changes the physical state of the conductive material from solid ribbon/mesh to a paste form that can be dispensed and printed. This parameter change allows the material to flow into precise patterns during application, achieving excellent shape control, and then sets to provide reliable current carrying capability. The paste form enables automated dispensing processes while maintaining high electrical conductivity.
Solution Approach 2:
The patent replaces the mechanical welding process required for ribbon/mesh interconnects with a dispensing and printing process for conductive paste. This substitution eliminates the need for specialized welding equipment and manual soldering, enabling automated manufacturing while maintaining excellent electrical connection and shape control through precise dispensing patterns.
2Ease of manufacture
If bond wires are used as alternative to ribbon/mesh interconnects, then ease of manufacture is improved, but current carrying capability deteriorates due to current crowding issues
Solution Approach 1:
The patent changes the form factor of the conductive material from thin wire to a broader paste pattern. This parameter change distributes the current over a larger cross-sectional area, eliminating current crowding issues while maintaining ease of manufacture through automated dispensing. The paste can be printed in patterns that optimize both current distribution and manufacturing efficiency.
3Reliability
If manual soldering is used for ribbon/mesh interconnects, then electrical connection is achieved, but productivity deteriorates due to labor intensive process
Solution Approach 1:
The patent replaces manual soldering operations with an automated dispensing and printing system for conductive paste. This substitution eliminates labor-intensive manual operations while maintaining reliable electrical connections. The automated system can precisely place conductive paste patterns, enabling high-volume production without sacrificing connection quality.
Solution Approach 2:
The conductive paste formulation includes flux and other components that enable the material to self-align and self-bond to the substrate and photovoltaic cell surfaces. This self-service capability eliminates the need for manual positioning and soldering operations, enabling automated application processes that maintain high connection reliability while dramatically improving productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the electrical performance of CPV modules by reducing resistivity and voltage drop, simplifying the manufacturing process, and avoiding the need for specialized equipment, while maintaining high current carrying capacity.
Implementation Method 1
a conductive paste is used as an alternative to wire bonds or braided ribbon/mesh connectors to facilitate the electrical connectivity between the photovoltaic die of the module and the conductive pattern of the underlying substrate thereof
Data Source
AI summary
In accordance with the present invention, there is provided a CPV module wherein a solder paste is used as an alternative to wire bonds or braided ribbon/mesh connectors to facilitate the electrical connectivity between the concentrated photovoltaic receiver cell or die of the CPV module and the conductive pattern of the underlying substrate thereof. In accordance with the present invention, the possibility of accidentally shorting the top of the receiver die with the other metal parts of the CPV module is avoided by molding at least the periphery of the receiver die with a mold body, and then dispensing or printing the conductive paste between the top of the receiver die and the substrate, the mold body defining a reservoir which facilities the flow of the conductive paste in a prescribed pattern.