Staggered CPW Air Bridge Layout for Dense Quantum Chip Routing
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Solution Overview
Problem
The existing air bridge layout methods for coplanar waveguides in superconducting quantum chips often result in air bridges being too close, affecting the success rate of circuit chip preparation due to mutual impacts and etching issues, especially in densely packed chip areas.
Innovation Solution
An air bridge layout method that determines interweave pairs of skeleton lines and arranges air bridges in a staggered manner to maximize distance between them, reducing mutual impacts and improving the success rate of circuit preparation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If air bridges are deployed along CPW lines based on coordinate information of skeleton lines, then air bridges can be systematically arranged to suppress parasitic modes, but air bridges on two close CPW lines become too close to each other, affecting the success rate of subsequent circuit chip preparation
Solution Approach 1:
The patent applies asymmetry by implementing a staggered arrangement where air bridges on adjacent CPW lines are offset from each other. Instead of symmetric alignment, the method calculates offset distances based on line spacing, creating an asymmetric pattern that maximizes the distance between air bridges on different lines while maintaining systematic coverage for parasitic mode suppression.
Solution Approach 2:
The patent transitions from a one-dimensional linear arrangement to a two-dimensional staggered grid pattern. By considering both the position along the CPW line and the offset between adjacent lines, the method creates a spatially optimized configuration that accounts for interactions in multiple dimensions, effectively increasing minimum separation distances.
2Reliability
If air bridges are closely spaced to cover the CPW lines effectively, then parasitic mode suppression is improved, but mutual impacts between air bridges increase and etching issues arise, reducing the success rate of circuit chip preparation
Solution Approach 1:
The patent performs preliminary calculation of air bridge positions using a staggered arrangement algorithm before fabrication. By pre-determining optimal offset distances based on CPW line spacing and air bridge dimensions, the method prevents harmful mutual impacts and etching issues before they occur, ensuring adequate separation while maintaining effective coverage.
Solution Approach 2:
The patent applies local quality by adjusting the staggered offset distance based on local conditions such as CPW line spacing and air bridge density. In regions where lines are closer together, larger offsets are applied to prevent mutual impacts, while in regions with greater spacing, smaller offsets maintain effective coverage without excessive separation.
Data Source
AI summary
A method of designing an air bridge layout in a circuit layout is performed by a computer device, and in particular, relates to the field of chip technologies. The method includes: obtaining position information of skeleton lines of CPW lines based on position information of the coplanar waveguide CPW lines in the circuit layout, each skeleton line being a center line of a corresponding CPW line; obtaining an interweave pair from the skeleton lines of the CPW lines based on the position information of the skeleton lines of the CPW lines, the interweave pair including two parallel skeleton line segments; and deploying air bridges on the circuit layout, the air bridges being deployed along the skeleton lines, and the air bridges on the two skeleton lines in the interweave pair being arranged in a staggered manner (340). According to the foregoing solution, interferences between air bridges on different CPW lines are reduced, and a success rate of subsequent circuit fabrication is improved.