CPW Antenna Interconnect Layout for Thin RF Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing antenna systems face challenges in achieving a compact, low-profile design while maintaining high efficiency and reliability, particularly in integrating RF components with RFIC chips, due to the complexity of interconnection structures and the need for additional layers that increase thickness.
Innovation Solution
The use of a coplanar waveguide (CPW) interconnects between RF components, integrated within the same layer as the antenna ground plane, eliminates the need for additional RF redistribution layers, allowing for a single-layer substrate configuration that reduces thickness and simplifies manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional RF redistribution layers are used to integrate RF components, then signal transmission quality is improved, but substrate thickness and device complexity increase
Solution Approach 1:
The patent merges the RF signal transmission function with the existing ground plane layer by etching openings in the ground plane to expose underlying conductive layers, eliminating the need for separate RF redistribution layers. This integration maintains signal transmission quality while reducing substrate thickness and device complexity.
Solution Approach 2:
The patent transitions from a multi-layer vertical stacking approach to a planar etching approach by creating openings in the ground plane and using conductive posts to connect to underlying layers. This dimensional change allows RF signal transmission without adding substrate thickness.
2Reliability
If additional RF redistribution layers are used to integrate RF components, then signal transmission quality is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines the RF signal transmission function with the ground plane layer, eliminating the need for separate RF redistribution layers. This merging reduces the number of manufacturing steps, layers to align, and materials to process, thereby simplifying manufacturing while maintaining signal transmission quality.
Solution Approach 2:
The patent extracts the RF signal transmission function from the traditional multi-layer structure and implements it through etched openings in the ground plane with conductive posts. This extraction eliminates complex layer stacking and alignment requirements, reducing manufacturing complexity.
3Productivity
If RF components are distributed across the antenna aperture, then beamforming efficiency is improved, but interconnection complexity increases
Solution Approach 1:
The patent merges the interconnection function with the ground plane structure by using etched openings and conductive posts. This integration provides direct, low-complexity interconnection paths between distributed RF components while maintaining beamforming efficiency.
Solution Approach 2:
The patent introduces conductive posts as intermediaries to connect RF components distributed across the antenna aperture to the ground plane and underlying signal layers. These posts provide simple, direct electrical connections that reduce interconnection complexity while enabling distributed component placement for efficient beamforming.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a thinner antenna substrate with improved manufacturing efficiency and reliability by integrating RF components without additional layers, while maintaining effective signal transmission and beamforming capabilities.
Implementation Method 1
A coplanar waveguide (CPW) interconnect couples the first RF component to the second RF component and includes a central conductor and first and second ground conductors on opposite sides of the central conductor
Data Source
AI summary
An antenna apparatus includes an antenna substrate having a first surface and an opposite second surface, with an antenna ground plane at the second surface. An antenna element is at the first surface of the antenna substrate. A first RF component is attached to the second surface of the antenna substrate and includes RF circuitry to adjust a signal communicated with the antenna element. A second RF component is attached to the second surface of the antenna substrate. A coplanar waveguide (CPW) interconnect couples the first RF component to the second RF component and includes a central conductor and first and second ground conductors on opposite sides of the central conductor. The central conductor has a profile within an opening in the antenna ground plane.