Cr Alloy Target Material Crater Prevention
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Solution Overview
Problem
The generation of abnormal discharge and droplets during arc ion plating using Cr alloy target materials containing Ti and V leads to deterioration in the smoothness and wear resistance of hard films on cutting tools and sliding components, due to local melting caused by oxidatively active elements.
Innovation Solution
A Cr alloy target material with a controlled composition, including specific atomic ratios of Cr, Ti, V, and other elements, and limited contents of oxygen, sulfur, aluminum, and silicon, to prevent crater formation and droplet adhesion, achieved by adjusting the sintering process and powder particle size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Ti and V are added to Cr alloy target material to improve adhesion, then adhesion is improved, but abnormal discharge and droplet generation occur
Solution Approach 1:
The patent applies parameter changes by precisely controlling the oxygen content (50-700 ppm) and total content of S, Al, and Si (300 ppm or less) in the Cr alloy target material. This quantitative control of impurity parameters prevents local melting while maintaining the beneficial adhesion properties of Ti and V additions.
Solution Approach 2:
The patent applies local quality by creating a non-uniform distribution of oxygen and impurity elements within the target material matrix. The controlled oxygen content (50-700 ppm) is specifically distributed to prevent crater formation at the surface while allowing Ti and V to maintain their adhesion-enhancing properties in the bulk material.
2Object-affected harmful factors
If oxygen content is increased to prevent crater formation, then crater formation is reduced, but oxidation of Ti and V may increase
Solution Approach 1:
The patent resolves this contradiction by optimizing the oxygen content parameter to a specific range (50-700 ppm). This precise parameter control is sufficient to prevent crater formation and local melting, yet low enough to minimize oxidation of Ti and V, thereby balancing both requirements.
3Object-affected harmful factors
If S, Al, and Si content is reduced to prevent crater formation, then crater formation is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent applies parameter changes by setting the total content of S, Al, and Si at 300 ppm or less. This consolidated parameter control simplifies manufacturing specifications compared to controlling each element separately, while effectively preventing crater formation through the combined limitation of these three impurity elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively limits crater formation and droplet adhesion on the target material, enhancing the smoothness and wear resistance of the hard films applied to cutting tools and sliding components.
Implementation Method 1
a target material which is a raw material of a hard film is instantly dissolved and ionized by arc discharge and is adhered to a negatively-applied material to be treated to form a hard film
Implementation Method 2
an ionization rate of an evaporated metal is higher
Implementation Method 3
an arc ion plating method, which is a type of ion plating method
Data Source
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AI summary
Provided is a Cr alloy target material with which formation of craters on the surface of the Cr alloy target material during film formation can be limited and the adhesion of droplets on the material being treated can be limited. The Cr alloy target material is represented by an atom ratio composition formula of Cr100-x-yM1xM2y, wherein 0.1≤x≤21.0, 0.1≤y≤23.0, M1 is at least one kind of element selected from Ti and V, and M2 is at least one kind of element selected from Mo, Mn, B, W, Nb and Ta, with the balance being unavoidable impurities. The Cr alloy target material contains 10-1000 mass ppm of oxygen as an unavoidable impurity.